Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74AUP2G17FW3-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 3.6V 6DFN	4984
SN74AUP2G07DSFR Texas Instruments	IC BUFFER NON-INVERT 3.6V 6SON	27010
74AUP1G125GS,132 Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	143338
SN74LVC1G06DBVRG4 Texas Instruments	IC BUFFER INVERT 5.5V SOT23-5	9417
74LCXZ16245MTDX	IC TXRX NON-INVERT 3.6V 48TSSOP	25806
SN74LV125APW Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	98
74AUP1G240GN,132 Nexperia	IC BUFFER INVERT 3.6V 6XSON	0
MC74LVX244DTG Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 20TSSOP	7156750
74AVCH4T245PW118 NXP Semiconductors	IC TRANSLATION TXRX 3.6V 16TSSOP	2460
74VHCT126BQ,115 Nexperia	IC BUF NON-INVERT 5.5V 14DHVQFN	690
SN74S240NG4 Texas Instruments	IC BUFFER INVERT 5.25V 20DIP	0
SN74HC540NG4 Texas Instruments	IC BUFFER INVERT 6V 20DIP	0
M74VHC1G126DTT1G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V 5TSOP	780942000
SN74ALVCHS162830GR Texas Instruments	IC ADDRESS DRIVER 3.6V 80TSSOP	83990
74AVC16245DGG,118 Nexperia	IC TXRX NON-INVERT 3.6V 48TSSOP	2201
SN74HC125DRE4 Texas Instruments	IC BUFFER NON-INVERT 6V 14SOIC	0
SN74AHC540NSR Texas Instruments	IC BUFFER INVERT 5.5V 20SO	6000
SN74AVC4T245PWE4 Texas Instruments	IC TRANSLATION TXRX 3.6V 16TSSOP	345
74AHC541BQ-Q100X Nexperia	IC BUF NON-INVERT 5.5V 20DHVQFN	0
SN74LS240N3 Texas Instruments	BUS DRIVER, LS SERIES	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications