Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HCT540NE4	IC BUFFER INVERT 5.5V 20DIP	820
74AC646SCX	IC TXRX NON-INVERT 6V 24SOP	5970
CD74FCT162245CTSM96	16-BIT BIDIRECTIONAL TRANSCVR	1000
SN74ABT16543DLR Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	19512
SN74AHC540PWR Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	2026
IDT74FCT827BTPY	74FCT827 - FAST 10-BIT BUFFER	46510
SN74AHCT540DWRE4 Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	0
SN74ABT245BPW Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	647
74ABT543ADB,118 NXP Semiconductors	IC TXRX NON-INVERT 5.5V 24SSOP	2650
74ALVT162241DL,112 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 48SSOP	1581
CY74FCT374TQC Texas Instruments	BUS DRIVER, FCT SERIES	1118
SN74LS465DW Texas Instruments	IC BUF NON-INVERT 5.25V 20SOIC	7121
CD74FCT16827ETMT	FAST CMOS 20-BIT BUFFER	1000
SN74AHC541DWRE4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0
NC7SZ125P5	IC BUFFER NON-INVERT 5.5V SC70-5	91459
74ALVCH32245BFG8 Renesas Electronics America	IC TXRX NON-INVERT 3.6V 96CABGA	0
74LCXZ2245MTC	IC TXRX NON-INVERT 3.6V 20TSSOP	7300
74LVC1G17GM,115 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	1569
74AVC16245DGVRG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 48TVSOP	0
54ACTQ245LMQB-R	54ACTQ245 - BUS DRIVER/TRANSCEIV	318

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications