Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
MAX4744HELB+T

MAX4744HELB+T

Maxim Integrated

IC SWITCH DUAL SPDT 10UDFN

0

MAX4547CEE+

MAX4547CEE+

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16QSOP

1083200

FSAV332MTC

FSAV332MTC

SPST, 4 FUNC, 1 CHANNEL

20665

MAX310CPE+

MAX310CPE+

Maxim Integrated

IC VIDEO MULTIPLEXER 8X1 16DIP

121700

PEX8764-AB80BI G

PEX8764-AB80BI G

Broadcom

PEX8764-AB80BI G

124

TS3DS10224RUKR

TS3DS10224RUKR

Texas Instruments

TS3DS10224 HIGH-SPEED 2:4 DIFFER

995

PI5L200WE

PI5L200WE

Zetex Semiconductors (Diodes Inc.)

IC ETHERNET SWITCH QUAD 16SOIC

0

NCN2612BMTTWG

NCN2612BMTTWG

SPDT, 1 FUNC, 1 CHANNEL

5580

PI5USB2544ZHEX

PI5USB2544ZHEX

Zetex Semiconductors (Diodes Inc.)

IC USB CNTRL DETECT SWTCH 16TQFN

0

LMH6572MQX/NOPB

LMH6572MQX/NOPB

Texas Instruments

IC VIDEO MULTIPLEXER 2X1 16SSOP

0

MAX4573CAI+T

MAX4573CAI+T

Maxim Integrated

IC AUDIO/VIDEO SWITCH 11 28SSOP

0

TS3L100D

TS3L100D

Texas Instruments

SPDT, 4 FUNC, 1 CHANNEL, PDSO16

15440

PI2PCIE2214ZHEX

PI2PCIE2214ZHEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 4:1 2.6GHZ 42TQFN

0

FSA801UMX

FSA801UMX

AUDIO/VIDEO SWITCH, 1 FUNC, 3 CH

60000

HMC748LC3CTR

HMC748LC3CTR

Analog Devices, Inc.

IC SELECTOR 2:1 14GBPS 16SMD

0

HV20220PJ-G

HV20220PJ-G

Roving Networks / Microchip Technology

IC ULTRASOUND SWITCH 1:1 28PLCC

2

MAX4589CAP+

MAX4589CAP+

Maxim Integrated

IC RF/VIDEO MUX DUAL 2CH 20-SSOP

1320

FSAV330M

FSAV330M

AUDIO/VIDEO SWITCH

5760

TS3L110DBQRG4

TS3L110DBQRG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16SSOP

0

TS5V330RGYR

TS5V330RGYR

Texas Instruments

TS5V330 QUAD-SPDT WIDE-BANDWIDTH

15975

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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