Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
TS5USBA43402YZPR

TS5USBA43402YZPR

Texas Instruments

ANALOG CIRCUIT, 1 FUNC, 2 CHANNE

36000

TUSB1046A-DCIRNQT

TUSB1046A-DCIRNQT

Texas Instruments

10GBPS TYPEC DP ALT MODE REDRIVE

278

STMUX1800EQTR

STMUX1800EQTR

STMicroelectronics

IC MUX/DEMUX 16X8 42QFN

0

HV2803/AHA

HV2803/AHA

Roving Networks / Microchip Technology

HV MUX (SPST)

222

ISL54400IRUZ-T

ISL54400IRUZ-T

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, 1 CHANNEL, CMOS

0

TS3USB3000RSER

TS3USB3000RSER

Texas Instruments

IC USB SW/MHL DPDT 10UQFN

0

AD8116JSTZ

AD8116JSTZ

Analog Devices, Inc.

IC VIDEO CROSSPOINT SWIT 128LQFP

6

PEX8716-CA80BC G

PEX8716-CA80BC G

Broadcom

IC PCI EXPRESS SWITCH 324FCBGA

46

MAX9176EUB+T

MAX9176EUB+T

Maxim Integrated

IC MULTIPLEXER 2:1 670MHZ 10UMAX

0

FSAV433BQX

FSAV433BQX

VIDEO MULTIPLEXER

6020

ISL54227IRTZ-T

ISL54227IRTZ-T

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL DPST 10TDFN

0

PEF24470HV1.3

PEF24470HV1.3

IR (Infineon Technologies)

MTSI-XL SWITCHING

1560

PEX8636-AA50RBC G

PEX8636-AA50RBC G

Broadcom

IC PCI EXPRESS SWITCH 1156FCBGA

0

NX3DV642GU,115

NX3DV642GU,115

NXP Semiconductors

IC SWITCH TPDT DIFF XQFN24

3446

FSA806UMX

FSA806UMX

AUDIO/VIDEO SWITCH, 3 CHANNEL, P

230173

HD3SS460RHRT

HD3SS460RHRT

Texas Instruments

IC MUX/DEMUX 4CH TYPE C2 28WQFN

96

OPA3875IDBQR

OPA3875IDBQR

Texas Instruments

OPA3875 TRIPLE 2:1 HIGH-SPEED VI

2305

HV2903/AHA

HV2903/AHA

Roving Networks / Microchip Technology

HV MUX (SPST)

108

FSUSB11MTCX

FSUSB11MTCX

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DUAL 1X1 14TSSOP

0

MAX4890EETJ+

MAX4890EETJ+

Maxim Integrated

IC ETHERNET SWITCH OCTAL 32TQFN

231

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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