Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
PI3DBS3224ZNAEX

PI3DBS3224ZNAEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX HS 2:4 20-TQFN

0

FSA2357MTCX

FSA2357MTCX

AUDIO/VIDEO SWITCH

59894

TS5L100DG4

TS5L100DG4

Texas Instruments

IC ETHERNET SWITCH QUAD 16SOIC

0

AD8184AR

AD8184AR

Analog Devices, Inc.

SINGLE-ENDED MULTIPLEXER, 1 FUNC

10341

MAX20328AEWA+T

MAX20328AEWA+T

Maxim Integrated

MUX SWITCH FOR THE USB TYPE-C AU

0

ADV3225ACPZ

ADV3225ACPZ

Analog Devices, Inc.

IC CROSSPOINT SW 16X8 72LFCSP

0

TS3L110RGYR

TS3L110RGYR

Texas Instruments

IC ETHERNET SWITCH QUAD 16VQFN

5031

MAX6509CAZK

MAX6509CAZK

Analog Devices, Inc.

RESISTOR-PROGRAMMABLE SOT TEMPER

1546

IH5341MTW

IH5341MTW

IH5341 DUAL RF/VIDEO SWITCH

46

ISL54210IRTZ-T

ISL54210IRTZ-T

Intersil (Renesas Electronics America)

IC SWITCH DUAL SPDT HS 10-TDFN

0

TS5USBC412IYFFT

TS5USBC412IYFFT

Texas Instruments

DATA ACQ PLEXERS/SWITCHES

740

ISL54220IRTZ-T

ISL54220IRTZ-T

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL SPDT 10TDFN

0

NLAS7242MUTBG

NLAS7242MUTBG

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DPST 10UQFN

10609

SN080104RSER

SN080104RSER

Texas Instruments

USB SWITCH ICS ORDER

0

MAX4588EPI

MAX4588EPI

Analog Devices, Inc.

DUAL 4-CH RF/VIDEO MUX

0

CBTL02043BBQ,115

CBTL02043BBQ,115

NXP Semiconductors

IC MUX/DEMUX 2:1 PCI 20DHVQFN

2190

ISL54211IRTZ

ISL54211IRTZ

Intersil (Renesas Electronics America)

IC SWITCH DUAL SPDT HS 10-TDFN

0

FSA2271TUMX

FSA2271TUMX

LOW VOLTAGE DUAL-SPDT (0.4 OHM)

62919

MAX20328AEWA+

MAX20328AEWA+

Maxim Integrated

IC USB SWITCH USB TYPE-C 25WLP

6230

DS100MB203SQE/NOPB

DS100MB203SQE/NOPB

Texas Instruments

IC MUX/BUFFER DUAL PORT 54WQFN

1062

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

RFQ BOM Call Skype Email
Top