Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8548ECVTAUJD

MPC8548ECVTAUJD

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 1333MHZ, CMOS, PBGA783

698

MPC8343ECVRAGDB

MPC8343ECVRAGDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC II PRO PROCESSOR

36

MPC8306CVMADDCA

MPC8306CVMADDCA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC POWER ARCH SOC, 266MH

0

MPC8358VRAGDGA

MPC8358VRAGDGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

30

MPC8323VRADDCA

MPC8323VRADDCA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

160

MPC5553MVZ13

MPC5553MVZ13

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

60

P1014NSE5FFA

P1014NSE5FFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

1087

MCIMX27MJP4AR2

MCIMX27MJP4AR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX27 32 BIT MICROPROCESSOR, AR

3750

MPC8272VRPIEA557

MPC8272VRPIEA557

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH, 30

0

MPC875CVR133

MPC875CVR133

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

0

MPC8548ECPXAQGB

MPC8548ECPXAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

6

MCIMX6U6AVM08AB

MCIMX6U6AVM08AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, DUAL A

0

MC68360AI25VL

MC68360AI25VL

Freescale Semiconductor, Inc. (NXP Semiconductors)

IC MPU M683XX 25MHZ 240FQFP

15

MPC8547EVTAUJB

MPC8547EVTAUJB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA783

422

MPC8541EVTAJD

MPC8541EVTAJD

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

1489

MPC8544ECVTANGA

MPC8544ECVTANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 800MHZ, CMOS, PBGA783

17

MPC852TZT100A

MPC852TZT100A

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

76

MPC8572VTAULD

MPC8572VTAULD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA1023

40

MPC8308CZQAFD

MPC8308CZQAFD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 266MHZ, PBGA473

2520

MCIMX6L2EVN10AA

MCIMX6L2EVN10AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

210

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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