Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MC7447AHX1420LB

MC7447AHX1420LB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

3916

MPC8545PXANGB

MPC8545PXANGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 800MHZ, PBGA783

75

MC68HC705C8AFU

MC68HC705C8AFU

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, OTPROM, 2.1MHZ, PQFP64

400

MC68EN360AI25VL

MC68EN360AI25VL

Freescale Semiconductor, Inc. (NXP Semiconductors)

QUICC COMMUNICATIONS CONTROLLER,

0

MPC8536EBVTAQGA

MPC8536EBVTAQGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

105

MPC862PVR80B

MPC862PVR80B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

4464

MPC8535EAVTAQG

MPC8535EAVTAQG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

0

MPC8313CVRADDC

MPC8313CVRADDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

75

MPC8543VTAQGB

MPC8543VTAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

561

P5020NXE7VNB

P5020NXE7VNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR 64 BI

2

P3041NXN1PNB

P3041NXN1PNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

1500MHZ, CMOS, PBGA1295

31

MPC8378ECVRANGA

MPC8378ECVRANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

106

MPC8270ZQMIBA

MPC8270ZQMIBA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

601

MPC8535AVTAQG

MPC8535AVTAQG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

60

MPC5121VY400

MPC5121VY400

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MPU, 32-BIT, 400MHZ PBGA516

32966

MPC855TZQ80D4

MPC855TZQ80D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

186

P5010NXN1TNB

P5010NXN1TNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64 BIT POWER ARCH SOC, 1.

24

MCIMX507CVK8BR2

MCIMX507CVK8BR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX50 32-BIT MPU, ARM CORTEX-A8

53000

P2041NSN1PNB

P2041NSN1PNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ INTEGRATED PROCESSOR

741

MPC8245LZU350D

MPC8245LZU350D

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROCONTROLLER, 32 BIT, PO

243

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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