Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MC9S12DG256CMPV

MC9S12DG256CMPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 25MHZ

278

MPC8360EVVAGDGA

MPC8360EVVAGDGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

47

P4080NSE1MMB

P4080NSE1MMB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

7

MPC855TCZQ50D4557

MPC855TCZQ50D4557

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

0

MPC8555EVTAQF

MPC8555EVTAQF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

216

MPC859DSLCVR50A

MPC859DSLCVR50A

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

176

MCIMX6L3DVN10AA

MCIMX6L3DVN10AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

1770

MPC8572ECPXAULD

MPC8572ECPXAULD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA1023

10

MC68340FE25E

MC68340FE25E

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 25.16MHZ, HCMOS

72

MPC5200CVR266

MPC5200CVR266

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

360

P3041NSE7PNC

P3041NSE7PNC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 4

15

P5020NSE1VNB

P5020NSE1VNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

1

MPC860DPZQ50D4557

MPC860DPZQ50D4557

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

2462

MPC8555VTALF

MPC8555VTALF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

1620

MCIMX6L8DVN10AB

MCIMX6L8DVN10AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32-BIT MPU, ARM CO

1581

MC68EC000FU16

MC68EC000FU16

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 16.67MHZ PQFP64

1260

MPC8360EZUALFHA

MPC8360EZUALFHA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

534

MPC8536AVTAQGA

MPC8536AVTAQGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

833

MC9328MXLDVM15-FR

MC9328MXLDVM15-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32-BIT, 150

0

MPC8572EVTARLE

MPC8572EVTARLE

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

6

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
RFQ BOM Call Skype Email
Top