Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
MCR908JK1ECPE

MCR908JK1ECPE

Flip Electronics

DESCRIPTION: 8-BIT MICROCONTROLL

0

MC908QC8CDTE

MC908QC8CDTE

Flip Electronics

MICROCONTROLLER, CMOS

0

MC908JL3ECPE

MC908JL3ECPE

Flip Electronics

MICROCONTROLLER IC 8-BIT 8MHZ 4K

0

MCF5270CAB100

MCF5270CAB100

Flip Electronics

IC MCU 32BIT ROMLESS 160QFP

0

MC9S08GT32ACBE

MC9S08GT32ACBE

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 1

0

LH79524N0F100A1;55

LH79524N0F100A1;55

Flip Electronics

IC MCU 32BIT ROMLESS 208LFBGA

24018

MC9S08GT8ACBE

MC9S08GT8ACBE

Flip Electronics

IC MCU 8BIT 8KB FLASH 42DIP

0

MC908QY4ACDTE

MC908QY4ACDTE

Flip Electronics

HC08 HC08 MICROCONTROLLER IC 8-B

0

MC908EY16ACFJER

MC908EY16ACFJER

Flip Electronics

HC08 MICROCONTROLLER IC 8-BIT 8M

0

MCR705JP7CDWE

MCR705JP7CDWE

Flip Electronics

MICROCONTROLLER, CMOS

0

MC908EY8AMFJE

MC908EY8AMFJE

Flip Electronics

8 BIT, 6K FLASH,512K RAM

0

MK21DN512VLK5

MK21DN512VLK5

Flip Electronics

RISC MICROCONTROLLER, 32-BIT, FL

0

MMC2114CFCAF33

MMC2114CFCAF33

Flip Electronics

MICROCONTROLLER

0

MCF5271CAB100

MCF5271CAB100

Flip Electronics

RISC MICROPROCESSOR, 32-BIT, 100

33179

MC9S12XDT256VAG

MC9S12XDT256VAG

Flip Electronics

IC MCU 16BIT 256KB FLASH 144LQFP

0

MC908GT16CFBER

MC908GT16CFBER

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 8

0

LH7A404N0F092B3;55

LH7A404N0F092B3;55

Flip Electronics

IC MCU 32BIT ROMLESS 324LFBGA

14858

HD6417750RF240V

HD6417750RF240V

Flip Electronics

RISC MICROPROCESSOR, 32-BIT, 240

0

MC908QY1ACPE

MC908QY1ACPE

Flip Electronics

HC08 HC08 MICROCONTROLLER IC 8-B

0

MC68HC705C9ACFNE

MC68HC705C9ACFNE

Flip Electronics

MICROCONTROLLER, 8-BIT, OTPROM,

32885

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
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