Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
MCHSC705C8ACPE

MCHSC705C8ACPE

Flip Electronics

MICROCONTROLLER, CMOS

0

MCHC705JP7CDWE

MCHC705JP7CDWE

Flip Electronics

IC MCU 8BIT 6KB OTP 28SOIC

0

MC908AS60ACFNE

MC908AS60ACFNE

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 8

0

MC908QC16CDSE

MC908QC16CDSE

Flip Electronics

HC08 HC08 MICROCONTROLLER IC 8-B

0

MC908QY1ACDTE

MC908QY1ACDTE

Flip Electronics

HC08 MICROCONTROLLER IC 8-BIT 8M

0

SPC5777CK2MME3

SPC5777CK2MME3

Flip Electronics

RISC MICROCONTROLLER, CMOS

0

MC9S08SE8CRL

MC9S08SE8CRL

Flip Electronics

IC MCU 8BIT 8KB FLASH 28DIP

0

MCR908JK3ECPE

MCR908JK3ECPE

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 6

0

MCHC908JK3ECPE

MCHC908JK3ECPE

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 6

0

MC908JL16CDWE

MC908JL16CDWE

Flip Electronics

MICROCONTROLLER, CMOS

0

MC908JL8CPE

MC908JL8CPE

Flip Electronics

HC08 MICROCONTROLLER IC 8-BIT 8M

4663

MC9S12XD256CAG

MC9S12XD256CAG

Flip Electronics

16-BIT MICROCONTROLLERS - MCU 51

0

MC9S12E256MFUE

MC9S12E256MFUE

Flip Electronics

MICROCONTROLLER, 16-BIT, FLASH,

0

MMC2114CFCVM33

MMC2114CFCVM33

Flip Electronics

IC MCU 32BIT 256KB FLASH 196BGA

0

MC9S08RG32CFJER

MC9S08RG32CFJER

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 8

0

CY8C5488FNI-LP212T

CY8C5488FNI-LP212T

Flip Electronics

IC MCU 32BIT 256KB FLASH 99WLCSP

190

LH79520N0Q000B1;55

LH79520N0Q000B1;55

Flip Electronics

IC MCU 32BIT ROMLESS 176LQFP

23169

MCF5270AB100

MCF5270AB100

Flip Electronics

MICROPROCESSORS - MPU MCF5232 V2

0

MCF5233CVM100J

MCF5233CVM100J

Flip Electronics

IC MCU 32BIT ROMLESS 256MAPBGA

0

MC908JK8MDWE

MC908JK8MDWE

Flip Electronics

IC MCU 8BIT 8KB FLASH 20SOIC

0

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
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