Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
MC908QY4ACDTER

MC908QY4ACDTER

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 6

0

MC908QT4AMPE

MC908QT4AMPE

Flip Electronics

IC MCU 8BIT 4KB FLASH 8DIP

0

MB90F574APFV-GE1

MB90F574APFV-GE1

Flip Electronics

IC MCU 16BIT 256KB FLASH 120QFP

0

CY8C27443-24PXI

CY8C27443-24PXI

Flip Electronics

MULTIFUNCTION PERIPHERAL, CMOS,

20200

MC908QY2AMDTE

MC908QY2AMDTE

Flip Electronics

HC08 HC08 MICROCONTROLLER IC 8-B

0

MC705JJ7CDWE

MC705JJ7CDWE

Flip Electronics

IC MCU 8BIT 6KB OTP 20SOIC

0

MCF5272VM66R2J

MCF5272VM66R2J

Flip Electronics

RISC MICROPROCESSOR, 32-BIT, 66M

0

MB90F474HPFR-GE1

MB90F474HPFR-GE1

Flip Electronics

IC, EEPROM

0

MCHC908JK8CPE

MCHC908JK8CPE

Flip Electronics

IC MCU 8BIT 8KB FLASH 20DIP

0

MC908LJ24CPBE

MC908LJ24CPBE

Flip Electronics

MICROCONTROLLER, 8-BIT, FLASH, 6

0

LH79525N0Q100A1;55

LH79525N0Q100A1;55

Flip Electronics

IC MCU 32BIT ROMLESS 176LQFP

10243

MC908MR8CDWE

MC908MR8CDWE

Flip Electronics

INTEGRATED CIRCUIT

0

MCF5272VF66J

MCF5272VF66J

Flip Electronics

INTEGRATED CIRCUIT

0

MC705P6ECPE

MC705P6ECPE

Flip Electronics

8 BIT OTP MCU - 705P6E - EPP

32433

MC908QY2AMPE

MC908QY2AMPE

Flip Electronics

NITRON CI 908QY4A SOG

0

MC908GT16CFBE

MC908GT16CFBE

Flip Electronics

8 BIT MCU W 16K FLASH

0

MC908JL8MDWE

MC908JL8MDWE

Flip Electronics

MICROCONTROLLER IC 8-BIT 8MHZ 8K

0

MC68HC11E1CFNE3R

MC68HC11E1CFNE3R

Flip Electronics

IC MCU 8BIT ROMLESS 52PLCC

450

LH75411N0Q100C0

LH75411N0Q100C0

Flip Electronics

IC MCU 32BIT ROMLESS 144LQFP

16027

MC908EY16ACFJE

MC908EY16ACFJE

Flip Electronics

MICROCONTROLLER, CMOS

0

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
RFQ BOM Call Skype Email
Top