Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
MD87C51-16/B

MD87C51-16/B

Rochester Electronics

MICROCONTROLLER, CMOS

108

MR80C31BH/B

MR80C31BH/B

Rochester Electronics

MICROCONTROLLER

672

TN8797BH

TN8797BH

Rochester Electronics

MICROCONTROLLER, 16 BIT, OTPROM,

408

MB9BF168RPMC-G-JNE2

MB9BF168RPMC-G-JNE2

Rochester Electronics

IC MCU 32BIT 1.03125MB 120LQFP

320

MQ80C196KB-12

MQ80C196KB-12

Rochester Electronics

MICROCONTROLLER, 16 BIT, 6MHZ, C

0

MB9AF344NBBGL-GE1

MB9AF344NBBGL-GE1

Rochester Electronics

32 BIT ARM CORTEX-M3 BASED MICRO

320

MC87C51FCZ/B

MC87C51FCZ/B

Rochester Electronics

MICROCONTROLLER

328

MG87C196KC/B

MG87C196KC/B

Rochester Electronics

MG87C196KC/B

1622

2952ADC

2952ADC

Rochester Electronics

2952ADC

566

N87C196KC-20

N87C196KC-20

Rochester Electronics

MICROCONTROLLER, 16 BIT, OTPROM,

284

2910ADM/B

2910ADM/B

Rochester Electronics

CONTROLLER

12

MQ8097BH/R

MQ8097BH/R

Rochester Electronics

MQ8097BH/R

218

P80C152JC-1

P80C152JC-1

Rochester Electronics

MICROCONTROLLER, 8 BIT, 8051 CPU

164

MG8097

MG8097

Rochester Electronics

MICROCONTROLLER, CMOS

212

MD8748H/B

MD8748H/B

Rochester Electronics

RISC MICROCONTROLLER, CMOS

18

8751H-8/BQA

8751H-8/BQA

Rochester Electronics

MICROCONTROLLER, 8 BIT, UVPROM,

0

U8797BH

U8797BH

Rochester Electronics

MICROCONTROLLER, 16-BIT, OTPROM,

5542

P89LPC932A1FDH

P89LPC932A1FDH

Rochester Electronics

P89LPC932 - 80C51, 8-BIT MICROCO

0

2964B/BUA

2964B/BUA

Rochester Electronics

DYNAMIC MEMORY CONTROLLER

1320

ELANSC300-33KC-G

ELANSC300-33KC-G

Rochester Electronics

MICROCONTROLLER, 32 BIT CPU

1254

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
RFQ BOM Call Skype Email
Top