Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
TN8097BH

TN8097BH

Rochester Electronics

MICROCONTROLLER, 16-BIT, 8096 CP

578

2909ADC

2909ADC

Rochester Electronics

2909ADC

2636

P8095BH

P8095BH

Rochester Electronics

MICROCONTROLLER, 16 BIT, 8096 CP

769

MD87C51FC/R

MD87C51FC/R

Rochester Electronics

8 BIT CHMOS MICROCONTROLLER 4K;

2124

MG87C196KD-16/R

MG87C196KD-16/R

Rochester Electronics

MG87C196KD-16/R

0

TN87C196KC-20

TN87C196KC-20

Rochester Electronics

MICROCONTROLLER, 16 BIT, OTPROM,

0

MB9AF112NBGL-GE1

MB9AF112NBGL-GE1

Rochester Electronics

FUJITSU MCU

100

MC8751H-8/BQA

MC8751H-8/BQA

Rochester Electronics

DUAL MARKED (8419001QA)

19

MQ8097/B

MQ8097/B

Rochester Electronics

DUAL MARKED (8506301YA)

598

2904DM

2904DM

Rochester Electronics

CONTROLLER

485

2910ADC

2910ADC

Rochester Electronics

CONTROLLER

266

P8798

P8798

Rochester Electronics

MICROCONTROLLER, 16 BIT, OTPROM,

9203

P80C32SBPN

P80C32SBPN

Rochester Electronics

P80C32 - 80C51 8 BIT MICROCONTRO

0

87C51/BUA

87C51/BUA

Rochester Electronics

DUAL MARKED (5962-8768401MUA)

1

MC68HC711E9CFU3

MC68HC711E9CFU3

Rochester Electronics

8 BIT; OTPROM; 3 MHZ; MICROCONTR

0

EE80C196KB-16

EE80C196KB-16

Rochester Electronics

MICROCONTROLLER, 16-BIT, MCS-96

178

MQ8097BH/BYA

MQ8097BH/BYA

Rochester Electronics

DUAL MARKED (5962-8959601YA)

1820

2904/BQA

2904/BQA

Rochester Electronics

DUAL MARKED (8601701QA)

854

MB9BF166RPMC-G-JNE2

MB9BF166RPMC-G-JNE2

Rochester Electronics

IC MCU 32BIT 544KB FLASH 120LQFP

80

2910ALM/B

2910ALM/B

Rochester Electronics

CONTROLLER

455

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
RFQ BOM Call Skype Email
Top