Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
MR87C51-16/B

MR87C51-16/B

Rochester Electronics

8-BIT CHMOS MICROCONTROLLER 4K

17

P80C32SBAA

P80C32SBAA

Rochester Electronics

P80C32 - 80C51 8 BIT MICROCONTRO

0

MC80C31BH/B

MC80C31BH/B

Rochester Electronics

8 BIT MICROCONTROLLER

166

MD80C51FB (R1006)

MD80C51FB (R1006)

Rochester Electronics

MICROCONTROLLER, 8-BIT

0

2910A/BZC

2910A/BZC

Rochester Electronics

DUAL MARKED (7801702ZC)

36

MD80C31BH/R

MD80C31BH/R

Rochester Electronics

MICROCONTROLLER, 8-BIT

602

MQ8097BH

MQ8097BH

Rochester Electronics

MQ8097BH

1003

MQ87C196KC/R

MQ87C196KC/R

Rochester Electronics

16 BIT MICROCONTROLLER, HIGH PER

839

MR8751H-8/R

MR8751H-8/R

Rochester Electronics

MR8751H-8/R

1159

2910ADM

2910ADM

Rochester Electronics

CONTROLLER

77

MQ8097BH/B

MQ8097BH/B

Rochester Electronics

DUAL MARKED (5962-8959601YA)

114

MD80C51FB

MD80C51FB

Rochester Electronics

MICROCONTROLLER, 8-BIT

34

MC68HC711E9FN3

MC68HC711E9FN3

Rochester Electronics

MICROCONTROLLER, 8 BIT, UVPROM,

6544

MQ87C196KD-20/R

MQ87C196KD-20/R

Rochester Electronics

16 BIT MICROCONTROLLER, HIGH PER

0

MG8097BH/BZC

MG8097BH/BZC

Rochester Electronics

DUAL MARKED (5962-8959601ZC)

2711

N8251A-G

N8251A-G

Rochester Electronics

N8251A-G

1155

87C51-16/BUA

87C51-16/BUA

Rochester Electronics

DUAL MARKED (5962-8768402MUA)

1

MC80C31BH

MC80C31BH

Rochester Electronics

MICROCONTROLLER

190

AM188EM-20VC

AM188EM-20VC

Rochester Electronics

MICROCONTROLLER, 16 BIT, FLASH

300

MQ80C196KB-12/R

MQ80C196KB-12/R

Rochester Electronics

MICROCONTROLLER, 16-BIT, MCS-96

690

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
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