Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
1126-4-AL

1126-4-AL

RAF

ROUND SPACER ALUMINUM 3/8"

4903

M1324-4007-AL

M1324-4007-AL

RAF

6MM HEX X 31MM X M4 THD

292

1129-6-B-12

1129-6-B-12

RAF

1/4 RD X 9/16 X .140 ID

350

M0507-25-B

M0507-25-B

RAF

4_5_MM-ROUND_SPACER

1129

2321-2520-S-12

2321-2520-S-12

RAF

HEX STNDFF 1/4"-20 STEEL 1-1/2"

64

M2100-2545-B-12

M2100-2545-B-12

RAF

4.5MM HEX X 5MM X M2.5 THD

481

M2104-3005-N

M2104-3005-N

RAF

4.5MM HEX X 9MM X M3 THD

225

4640-832-SS

4640-832-SS

RAF

3/8 HEX X 1-1/2 LENGTH

151

1225-25-B-12

1225-25-B-12

RAF

1/2 RD X 3/4 X .252 ID

200

2179-1032-S-12

2179-1032-S-12

RAF

5/16 HEX X 1.00 LENGTH

300

4553-632-B

4553-632-B

RAF

1/4_HEX_MALE_FEMALE_STANDOFFS

546

M2188-5008-N

M2188-5008-N

RAF

8MM HEX X 13MM X M5 THD

284

4536-632-N

4536-632-N

RAF

1/4_HEX_MALE_FEMALE_STANDOFFS

770

4558-632-SS-20

4558-632-SS-20

RAF

1/4 HEX X 2.00 LENGTH

100

NAS1829A4C08

NAS1829A4C08

RAF

ALUMINUM 1/4 HEX MALE/FEMALE STA

0

2065-440-AL-7

2065-440-AL-7

RAF

HEX STANDOFF #4-40 ALUMINUM 1"

1361

4509-632-AL

4509-632-AL

RAF

3/16 HEX X 3/4 LENGTH

2152

4530-440-SS-20

4530-440-SS-20

RAF

1/4 HEX X 1/4 LENGTH

483

1688-440-AL

1688-440-AL

RAF

1/4 RD X 3/4 LENGTH

4932

2103-632-AL

2103-632-AL

RAF

HEX STANDOFF #6-32 ALUM 7/16"

1510

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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