Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M2157-3005-B-12

M2157-3005-B-12

RAF

HEX STANDOFF M3X0.5 BRASS 22MM

0

M1264-2545-SS-20

M1264-2545-SS-20

RAF

4.5MM HEX X 17MM X M2.5 THD

105

NAS1829C4G14

NAS1829C4G14

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

500

2235T-2520-B

2235T-2520-B

RAF

3/8_HEX_FEMALE_STANDOFFS

1185

M0502-25-SS

M0502-25-SS

RAF

ROUND SPACER STAINLESS STEEL 3MM

1359

4571A-832-B

4571A-832-B

RAF

5/16_HEX_MALE_FEMALE_STANDOFFS

1027

M1300-3005-AL

M1300-3005-AL

RAF

HEX STANDOFF M3X0.5 ALUMINUM 3MM

1013

2055T-256-N

2055T-256-N

RAF

HEX STANDOFF #2-56 NYLON 10.31MM

544

4506-256-AL

4506-256-AL

RAF

3/16 HEX X 9/16 LENGTH

188

2133-632-AL

2133-632-AL

RAF

1/4 HEX X 2-5/8 LENGTH

482

1291-31-S-12

1291-31-S-12

RAF

3/4 RD X 1.00 X .315 ID

150

2114-632-SS

2114-632-SS

RAF

HEX STANDOFF #6-32 SS 1-1/8"

850

NAS42DD6-68FC

NAS42DD6-68FC

RAF

ALUMINUM UNTHREADED SPACER 3/8 R

250

M1326-3005-SS

M1326-3005-SS

RAF

6MM HEX X 37MM X M3 THD

553

1281-31-S-12

1281-31-S-12

RAF

3/4 RD X 3/8 X .315 ID

153

M0652-4-SS

M0652-4-SS

RAF

10MM RD X 3MM X 4.3MM ID

200

4501-440-S

4501-440-S

RAF

3/16 HEX X 1/4 LENGTH

3225

3046-B-632-B-37

3046-B-632-B-37

RAF

1/4 RD X 3/16 LENGTH

800

1826-832-N

1826-832-N

RAF

3/8_ROUND_FEMALE_STANDOFFS

700

1680-632-SS

1680-632-SS

RAF

1/4 RD X 1/4 LENGTH

294

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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