Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
NAS1831H5C12

NAS1831H5C12

RAF

NYLON 5/16 HEX FEMALE STANDOFF 3

0

NAS1829A6J24

NAS1829A6J24

RAF

ALUMINUM 3/8 HEX MALE/FEMALE STA

0

M2114-3005-SS-20

M2114-3005-SS-20

RAF

4.5MM HEX X 19MM X M3 THD

242

1330A-6-SS

1330A-6-SS

RAF

1_4-HEX_SPACER

1500

1124-6-AL-6

1124-6-AL-6

RAF

ROUND SPACER ALUMINUM 1/4"

3188

M2143-3005-B-5

M2143-3005-B-5

RAF

6MM HEX X 8MM X M3 THD

829

2104-632-N

2104-632-N

RAF

HEX STANDOFF #6-32 NYLON 1/2"

1072

4535T-632-SS

4535T-632-SS

RAF

1/4 HEX X 19/32 LENGTH

250

M0652-5-S-12

M0652-5-S-12

RAF

10MM RD X 3MM X 5.3MM ID

270

M0506-25-AL

M0506-25-AL

RAF

ROUND SPACER ALUMINUM 7MM

1229

1248-31-SS

1248-31-SS

RAF

5/8 RD X 1/4 X .315 ID

130

2054-256-AL-7

2054-256-AL-7

RAF

HEX STANDOFF #2-56 ALUM 5/16"

1371

4042-832-SS

4042-832-SS

RAF

1/4 RD X 1.00 LENGTH

224

M0598-5-AL

M0598-5-AL

RAF

8_MM-ROUND_SPACER

636

1157-10-SS

1157-10-SS

RAF

5/16 RD X 3/8 X .192 ID

500

4595-832-SS

4595-832-SS

RAF

5/16 HEX X 1-3/4 LENGTH

162

1537-B-6-B

1537-B-6-B

RAF

1/4 RD X 1/2 X .140 ID

4980

2099T-632-N

2099T-632-N

RAF

1/4 HEX X 7/32 LENGTH

270

NAS1831C3A07

NAS1831C3A07

RAF

STAINLESS STEEL 3/16 HEX FEMALE

141

2266-832-SS

2266-832-SS

RAF

3/8 HEX X 2-1/2 LENGTH

80

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
RFQ BOM Call Skype Email
Top