Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M0502-3-SS

M0502-3-SS

RAF

ROUND SPACER STAINLESS STEEL 3MM

1976

M2117-3005-B

M2117-3005-B

RAF

4_5_MM_HEX_MALE_FEMALE_STANDOFFS

2518

1748-832-SS

1748-832-SS

RAF

5/16_ROUND_FEMALE_STANDOFFS

392

1681T-832-B

1681T-832-B

RAF

1/4_ROUND_FEMALE_STANDOFFS

1040

1684-1032-SS

1684-1032-SS

RAF

1/4 RD X 1/2 LENGTH

352

NAS1831C5D14

NAS1831C5D14

RAF

STAINLESS STEEL 5/16 HEX FEMALE

0

4532-632-S

4532-632-S

RAF

1/4 HEX X 3/8 LENGTH

398

M1260-2545-SS-20

M1260-2545-SS-20

RAF

4.5MM HEX X 13MM X M2.5 THD

475

4500-440-N

4500-440-N

RAF

HEX STANDOFF #4-40 NYLON 3/16"

3021

1198-10-AL

1198-10-AL

RAF

3/8 RD X 1.00 X .192 ID

988

M2100-3005-SS

M2100-3005-SS

RAF

HEX STANDOFF M3X0.5 SS 5MM

5802

M1257-3005-N

M1257-3005-N

RAF

4.5MM HEX X 10MM X M3 THD

4500

M0592-5-AL

M0592-5-AL

RAF

8MM RD X 3MM X 5.3MM ID

472

M0662-5-AL

M0662-5-AL

RAF

10MM RD X 13MM X 5.3MM ID

286

M1253-3005-N

M1253-3005-N

RAF

4_5_MM_HEX_FEMALE_STANDOFFS

927

M2160-4007-SS

M2160-4007-SS

RAF

HEX STANDOFF M4X0.7 SS 25MM

153

NAS61-04A-010

NAS61-04A-010

RAF

NYLON UNTHREADED SPACER 1/4 OD,#

500

9018-62-S-12

9018-62-S-12

RAF

ROUND SPACER STEEL 1-1/2"

100

M1302-4007-SS

M1302-4007-SS

RAF

6MM HEX X 5MM X M4 THD

488

M2105-3005-N

M2105-3005-N

RAF

HEX STANDOFF M3X0.5 NYLON 10MM

220

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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