Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
3853-B-440-AL

3853-B-440-AL

RAF

1/4_HEX_SWAGE_STANDOFFS_0_136_DI

1843

2114-632-AL-7

2114-632-AL-7

RAF

HEX STANDOFF #6-32 ALUM 1-1/8"

339

2114-832-N

2114-832-N

RAF

1/4 HEX X 1-1/8 LENGTH

355

1686-832-S-12

1686-832-S-12

RAF

1/4 RD X 5/8 LENGTH

598

NAS1829C3C10

NAS1829C3C10

RAF

STAINLESS STEEL 3/16 HEX MALE/FE

0

1156-4-SS

1156-4-SS

RAF

5_16-ROUND_SPACER

570

M2169-4007-SS

M2169-4007-SS

RAF

6MM HEX X 52MM X M4 THD

0

4521-440-B

4521-440-B

RAF

3/16_HEX_MALE_FEMALE_STANDOFFS

965

4032-832-SS

4032-832-SS

RAF

1/4 RD X 3/8 LENGTH

300

4507T-440-AL

4507T-440-AL

RAF

3/16_HEX_MALE_FEMALE_STANDOFFS

679

1132-4-SS

1132-4-SS

RAF

1/4 RD X 3/4 X .115 ID

950

1277-50-AL

1277-50-AL

RAF

3/4 RD X 1/8 X 0.505

1500

2132-632-AL-7

2132-632-AL-7

RAF

1/4 HEX X 2-1/2 LENGTH

272

9026-50-S-12

9026-50-S-12

RAF

ROUND SPACER STEEL 2"

99

M1311-4007-SS

M1311-4007-SS

RAF

6MM HEX X 14MM X M4 THD

200

1112-2-N

1112-2-N

RAF

3/16 RD X 7/16 X .090 ID

2922

M2141-4007-SS

M2141-4007-SS

RAF

6MM HEX X 6MM X M4 THD

390

2056-440-AL-7

2056-440-AL-7

RAF

HEX STANDOFF #4-40 ALUM 7/16"

3200

2052T-256-N

2052T-256-N

RAF

3/16 HEX X 7/32 LENGTH

701

M2200-5008-AL

M2200-5008-AL

RAF

8MM HEX X 25MM X M5 THD

499

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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