Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
NAS43DD4-256FC

NAS43DD4-256FC

RAF

ALUMINUM UNTHREADED SPACER 3/8 R

250

M0595-5-N

M0595-5-N

RAF

ROUND SPACER NYLON 6MM

706

M0595-3-N

M0595-3-N

RAF

8MM RD X 6MM X 3.2MM ID

500

M1505-B-2545-B-12

M1505-B-2545-B-12

RAF

4.5MM RD X 8MM X M2.5 THD

89

M0593-5-N

M0593-5-N

RAF

ROUND SPACER NYLON 4MM

1312

2130-632-N

2130-632-N

RAF

1/4 HEX X 2-1/4 LENGTH

75

2112-440-AL-7

2112-440-AL-7

RAF

HEX STANDOFF #4-40 ALUMINUM 1"

927

1154T-8-B

1154T-8-B

RAF

5_16-ROUND_SPACER

575

1117-4-AL-6

1117-4-AL-6

RAF

3/16 RD X 3/4 X .115 ID

340

M2189-3005-SS

M2189-3005-SS

RAF

8MM HEX X 14MM X M3 THD

645

2187-632-N

2187-632-N

RAF

HEX STANDOFF #6-32 NYLON 1-1/2"

62

2337-2520-S

2337-2520-S

RAF

1/2 HEX X 3.00 LENGTH

233

4558-440-S-12

4558-440-S-12

RAF

1/4 HEX X 2.00 LENGTH

218

2024-256-SS-20

2024-256-SS-20

RAF

1/8 HEX X 3/8 LENGTH

160

4587-832-SS

4587-832-SS

RAF

5/16 HEX X 1-1/4 LENGTH

250

3056-D-440-AL

3056-D-440-AL

RAF

1/4_ROUND_SWAGE_STANDOFFS

526

4579-1032-SS

4579-1032-SS

RAF

5/16 HEX X 3/4 LENGTH

369

2114-632-AL

2114-632-AL

RAF

HEX STANDOFF #6-32 ALUM 1-1/8"

638

M2240-5008-SS

M2240-5008-SS

RAF

10MM X 25MM X M5 THD

250

M2161-3005-AL

M2161-3005-AL

RAF

6MM HEX X 28MM X M3 THD

536

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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