Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
NAS43DD0-16A

NAS43DD0-16A

RAF

ALUMINUM UNTHREADED SPACER 3/16

0

9004-50-N

9004-50-N

RAF

ROUND SPACER NYLON 5/8"

200

1122-6-AL

1122-6-AL

RAF

ROUND SPACER ALUMINUM 1/8"

3066

NAS42DD8A-10FC

NAS42DD8A-10FC

RAF

ALUMINUM UNTHREADED SPACER 3/8 R

135

3030-B-256-AL-7

3030-B-256-AL-7

RAF

3/16 RD X 1/8 LENGTH

2650

2101-440-SS-20

2101-440-SS-20

RAF

1/4 HEX X 5/16 LENGTH

400

NAS1831A4B24

NAS1831A4B24

RAF

ALUMINUM 1/4 HEX FEMALE STANDOFF

0

4508-440-AL

4508-440-AL

RAF

HEX STANDOFF #4-40 ALUM 11/16"

384

NAS1831C4C22

NAS1831C4C22

RAF

STAINLESS STEEL 1/4 HEX FEMALE S

0

1230-8-N

1230-8-N

RAF

1/2 RD X 1 1/16 X .166 ID

290

M0541-4-N

M0541-4-N

RAF

ROUND SPACER NYLON 12MM

398

M2111-2545-SS

M2111-2545-SS

RAF

4.5MM HEX X 16MM X M2.5 THD

288

4502-440-S-12

4502-440-S-12

RAF

HEX STANDOFF #4-40 STEEL 5/16"

711

2266-1032-SS

2266-1032-SS

RAF

3/8 HEX X 2-1/2 LENGTH

115

2309-2520-AL

2309-2520-AL

RAF

1/2 HEX X 3/4 LENGTH

120

1679-632-SS

1679-632-SS

RAF

1/4 RD X 3/16 LENGTH

400

2108-632-SS-20

2108-632-SS-20

RAF

1/4 HEX X 3/4 LENGTH

370

2105-632-N

2105-632-N

RAF

HEX STANDOFF #6-32 NYLON 9/16"

427

1122-8-B-12

1122-8-B-12

RAF

1/4 RD X 1/8 X 0.166

2500

NAS1831C3B05

NAS1831C3B05

RAF

STAINLESS STEEL 3/16 HEX FEMALE

332

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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