Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M1323-3005-AL

M1323-3005-AL

RAF

6MM HEX X 28MM X M3 THD

250

2337-1032-SS-20

2337-1032-SS-20

RAF

1/2 HEX X 3.00 LENGTH

20

NAS1829C4D14

NAS1829C4D14

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

125

2100T-632-AL

2100T-632-AL

RAF

1/4 HEX X 9/32 LENGTH

2453

2053T-440-SS

2053T-440-SS

RAF

3/16 HEX X 9/32 LENGTH

401

9102-75-B-12

9102-75-B-12

RAF

ROUND SPACER BRASS 1/2"

48

M1007-3005-SS

M1007-3005-SS

RAF

4.5MM RD X 10MM X M3 THD

926

NAS61-04A-025

NAS61-04A-025

RAF

NYLON UNTHREADED SPACER 1/4 OD,#

0

M2147-4007-S-12

M2147-4007-S-12

RAF

HEX STANDOFF M4X0.7 STEEL 12MM

288

1516-B-2-AL

1516-B-2-AL

RAF

3/16 RD X 1/8 X .090 ID

500

M0541-3-N

M0541-3-N

RAF

6MM RD X 12MM X 3.2MM ID

300

1190-8-SS

1190-8-SS

RAF

3/8 RD X 1/2 X .166 ID

300

4538-832-SS

4538-832-SS

RAF

HEX STANDOFF #8-32 SS 3/4"

233

4503-440-AL

4503-440-AL

RAF

HEX STANDOFF #4-40 ALUMINUM 3/8"

1600

4562-632-S-12

4562-632-S-12

RAF

HEX STANDOFF #6-32 STEEL 2-1/2"

305

4534-632-B-12

4534-632-B-12

RAF

1/4 HEX X 1/2 LENGTH

2420

7302-C-440-B

7302-C-440-B

RAF

3/16 RD X 1/4 LENGTH

57

2246-832-AL

2246-832-AL

RAF

3/8 HEX X 1.00 LENGTH

500

NAS43DD6-113FC

NAS43DD6-113FC

RAF

ALUMINUM UNTHREADED SPACER 1/2 R

0

M1417-4007-AL

M1417-4007-AL

RAF

10MM HEX X 20MM X M4 THD

288

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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