Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
NAS1829C4E25

NAS1829C4E25

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

125

NAS42DD4A-31A

NAS42DD4A-31A

RAF

ALUMINUM UNTHREADED SPACER 3/16

0

4628-832-SS

4628-832-SS

RAF

3/8 HEX X 3/4 LENGTH

291

2396-3716-S-12

2396-3716-S-12

RAF

5/8 HEX X 2.00 LENGTH

96

1184-8-N

1184-8-N

RAF

3/8 RD X 1/8 X 0.166

4880

M2147-3005-AL

M2147-3005-AL

RAF

HEX STANDOFF M3X0.5 ALUM 12MM

1021

M1066-4007-AL

M1066-4007-AL

RAF

6_MM_ROUND_FEMALE_STANDOFFS

837

M2159-4007-AL-7

M2159-4007-AL-7

RAF

6MM HEX X 24MM X M4 THD

175

1689-832-AL

1689-832-AL

RAF

1/4 RD X 13/16 LENGTH

1000

1183-10-N

1183-10-N

RAF

5/16 RD X 2.00 X .192 ID

200

4500-632-SS

4500-632-SS

RAF

HEX STANDOFF #6-32 SS 3/16"

3936

2104-440-SS

2104-440-SS

RAF

HEX STANDOFF #4-40 SS 1/2"

262

4549-440-AL

4549-440-AL

RAF

HEX STANDOFF #4-40 ALUM 36.53MM

1488

M2234-4007-SS

M2234-4007-SS

RAF

10MM X 19MM X M4 THD

150

M1310-3005-B-5

M1310-3005-B-5

RAF

6MM HEX X 13MM X M3 THD

200

M1377-5008-S-12

M1377-5008-S-12

RAF

8MM HEX X 40MM X M5 THD

187

1533T-A-6-SS

1533T-A-6-SS

RAF

1_4-ROUND_SWAGE_SPACER

730

NAS1829C6E19

NAS1829C6E19

RAF

STAINLESS STEEL 3/8 HEX MALE/FEM

0

4042-632-SS

4042-632-SS

RAF

1/4 RD X 1.00 LENGTH

556

4041-440-AL

4041-440-AL

RAF

1_4_ROUND_MALE_FEMALE_STANDOFFS

710

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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