Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M1302-3005-SS

M1302-3005-SS

RAF

6MM HEX X 5MM X M3 THD

847

2179-832-S-12

2179-832-S-12

RAF

5/16 HEX X 1.00 LENGTH

420

2102T-632-B

2102T-632-B

RAF

1/4_HEX_FEMALE_STANDOFFS

995

2175-832-S-12

2175-832-S-12

RAF

5/16 HEX X 3/4 LENGTH

200

M1259-2545-N

M1259-2545-N

RAF

HEX STNDFF M2.5X0.45 NYLON 12MM

120

M2165-3005-S-12

M2165-3005-S-12

RAF

6MM HEX X 40MM X M3 THD

283

NAS1831C6D22

NAS1831C6D22

RAF

STAINLESS STEEL 3/8 HEX FEMALE S

0

3032-B-440-SS

3032-B-440-SS

RAF

3/16_ROUND_SWAGE_STANDOFFS

3500

1532-B-6-AL-22

1532-B-6-AL-22

RAF

1/4 RD X 3/16 X .140 ID

1500

2053T-440-AL

2053T-440-AL

RAF

3/16 HEX X 9/32 LENGTH

9875

2052T-256-AL

2052T-256-AL

RAF

3/16 HEX X 7/32 LENGTH

470

NAS1831A4C18

NAS1831A4C18

RAF

ALUMINUM 1/4 HEX FEMALE STANDOFF

0

2108-440-SS

2108-440-SS

RAF

HEX STANDOFF #4-40 SS 3/4"

437

4533-440-AL

4533-440-AL

RAF

HEX STANDOFF #4-40 ALUM 7/16"

782

NAS1831AC6E12

NAS1831AC6E12

RAF

ALUMINUM 3/8 HEX FEMALE STANDOFF

0

4623-832-B

4623-832-B

RAF

3/8_HEX_MALE_FEMALE_STANDOFFS

768

NAS42DD6-32FC

NAS42DD6-32FC

RAF

ALUMINUM UNTHREADED SPACER 3/8 R

200

NAS1829C6J08

NAS1829C6J08

RAF

STAINLESS STEEL 3/8 HEX MALE/FEM

95

M2107-3005-N

M2107-3005-N

RAF

HEX STANDOFF M3X0.5 NYLON 12MM

359

2118-440-SS

2118-440-SS

RAF

1/4 HEX X 1-3/8 LENGTH

449

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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