Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
2022-256-B

2022-256-B

RAF

1/8_HEX_FEMALE_STANDOFFS

1980

M0654-4-AL

M0654-4-AL

RAF

10MM RD X 5MM X 4.3MM ID

815

M0506-3-SS

M0506-3-SS

RAF

ROUND SPACER STAINLESS STEEL 7MM

137

4531-632-S-12

4531-632-S-12

RAF

HEX STANDOFF #6-32 STEEL 5/16"

1100

4500-632-N

4500-632-N

RAF

HEX STANDOFF #6-32 NYLON 3/16"

548

1641-440-AL

1641-440-AL

RAF

ROUND STANDOFF #4-40 ALUM 3/4"

655

NAS1829A4E08

NAS1829A4E08

RAF

ALUMINUM 1/4 HEX MALE/FEMALE STA

0

4501T-440-AL-7

4501T-440-AL-7

RAF

HEX STANDOFF #4-40 ALUM 7.14MM

2982

1696-440-N

1696-440-N

RAF

1/4 RD X 1-1/4 LENGTH

531

2056-440-S-12

2056-440-S-12

RAF

HEX STANDOFF #4-40 STEEL 7/16"

536

2132-832-AL

2132-832-AL

RAF

1/4 HEX X 2-1/2 LENGTH

299

1126-8-AL

1126-8-AL

RAF

ROUND SPACER ALUMINUM 3/8"

2961

NAS1831A4C19

NAS1831A4C19

RAF

ALUMINUM 1/4 HEX FEMALE STANDOFF

0

4038-632-B

4038-632-B

RAF

1_4_ROUND_MALE_FEMALE_STANDOFFS

1233

NAS1831C6E26

NAS1831C6E26

RAF

STAINLESS STEEL 3/8 HEX FEMALE S

460

4538-632-S

4538-632-S

RAF

1/4 HEX X 3/4 LENGTH

769

2246-832-SS-20

2246-832-SS-20

RAF

3/8 HEX X 1.00 LENGTH

124

4009-440-AL

4009-440-AL

RAF

3/16 RD X 3/4 LENGTH

155

4566-632-AL

4566-632-AL

RAF

1/4 HEX X 3.00 LENGTH

501

M0539-4-SS

M0539-4-SS

RAF

6MM RD X 10MM X 4.3MM ID

950

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
RFQ BOM Call Skype Email
Top