Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
1684-832-N

1684-832-N

RAF

1/4 RD X 1/2 LENGTH

288

9110-75-SS

9110-75-SS

RAF

ROUND SPACER STAINLESS STEEL 1"

32

1246A-12-AL

1246A-12-AL

RAF

5_8-ROUND_SPACER

1672

1606-080-AL

1606-080-AL

RAF

1/8 RD X 1/2 LENGTH

160

2058-440-SS

2058-440-SS

RAF

HEX STANDOFF #4-40 SS 9/16"

1274

4652-1032-SS

4652-1032-SS

RAF

3/8 HEX X 2-1/2 LENGTH

47

2104-440-AL-7

2104-440-AL-7

RAF

HEX STANDOFF #4-40 ALUMINUM 1/2"

2251

4532-632-S-12

4532-632-S-12

RAF

HEX STANDOFF #6-32 STEEL 3/8"

568

NAS1831AC4C06

NAS1831AC4C06

RAF

ALUMINUM 1/4 HEX FEMALE STANDOFF

500

M1802-A-2545-SS-20

M1802-A-2545-SS-20

RAF

4.5MM RD X 5MM X M2.5 THD

400

2059-440-S-12

2059-440-S-12

RAF

HEX STANDOFF #4-40 STEEL 5/8"

730

1893-1032-N

1893-1032-N

RAF

1/2_ROUND_FEMALE_STANDOFFS

900

4500-440-AL-6

4500-440-AL-6

RAF

3/16 HEX X 3/16 LENGTH

250

M2103-3005-SS-20

M2103-3005-SS-20

RAF

4.5MM HEX X 8MM X M3 THD

275

1029-093-SS

1029-093-SS

RAF

17/32OD X 10-32 THD

184

2070-440-AL

2070-440-AL

RAF

HEX STANDOFF #4-40 ALUM 1-5/16"

320

1123-4-N

1123-4-N

RAF

ROUND SPACER NYLON 3/16"

779

1104-2-N

1104-2-N

RAF

1/8 RD X 3/8 X .090 ID

1715

NAS1829C4F16

NAS1829C4F16

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

250

4189-1032-SS

4189-1032-SS

RAF

1/2 RD X 1-1/2 LENGTH

135

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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