Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
M0609-4-B RAF	8_MM-ROUND_SPACER	952
9100-100-SS RAF	ROUND SPACER SS 3/8"	48
7716 Keystone Electronics Corp.	ROUND STANDOFF #6-32 CERAMIC 1"	105415815
4833 Keystone Electronics Corp.	HEX STANDOFF #8-32 NYLON 7/8"	1553500
1923E Keystone Electronics Corp.	HEX STANDOFF #8-32 SS 1-1/2"	416
13SPRT040 Richco, Inc. (Essentra Components)	ROUND SPACER, RETAINING, #2 SCRE	2000
1160-10-S-12 RAF	ROUND SPACER STEEL 9/16"	525
13SP231 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	2800
TN8-28-1024-1 Richco, Inc. (Essentra Components)	RND STNDFF #10-24 NYLON 1-3/4"	146
13SP228 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	2976
15TSP149 Richco, Inc. (Essentra Components)	ROUND STANDOFF, #6-32 THREAD, .7	960
36440MF137 Richco, Inc. (Essentra Components)	MALE FEMALE THREADED STANDOFF, #	950
1902D Keystone Electronics Corp.	HEX STANDOFF #4-40 NYLON 3/4"	159932000
M1256-2545-SS RAF	HEX STANDOFF M2.5X0.45 SS 9MM	97
1220T-25-AL RAF	1/2 RD X 15/32 X .252 ID	1905
13SP032 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	38805
M2159-2545-N RAF	6MM HEX X 24MM X M2.5 THD	450
9912-625 Califia Lighting (Bivar)	ROUND SPACER #8 NYLON 5/8"	1000
94518203 Würth Elektronik Midcom	HEXAGONAL LOCK SCREW UNC 4/40 /	1839
4532T-632-N RAF	1/4 HEX X 13/32 LENGTH	200

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production