Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
M0712-8-SS RAF	13MM RD X 3MM X 8.4MM ID	243
13RS040083 Richco, Inc. (Essentra Components)	ROUND SPACER, .169 ID, .394 OD,	500
9026-50-SS RAF	ROUND SPACER STAINLESS STEEL 2"	32
24486 Keystone Electronics Corp.	HEX STANDOFF M3 SS 18MM	2497
3500D Keystone Electronics Corp.	ROUND STANDOFF #10-32 ALUM 3/4"	595800
2282-1032-N RAF	3/8 HEX X 6.00 LENGTH	98
1225-25-AL RAF	1/2 RD X 3/4 X .252 ID	483
M2274-5008-S-12 RAF	13MM HEX X 19MM X M5 THD	200
2166-1032-AL RAF	5/16 HEX X 3/16 LENGTH	250
1123-6-AL RAF	1/4 RD X 3/16 X .140 ID	1307
970280365 Würth Elektronik Midcom	PLASTIC SPACER STUD METRIC THREA	343
4042-632-AL RAF	1/4 RD X 1.00 LENGTH	100
13RS075057 Richco, Inc. (Essentra Components)	ROUND SPACER, .520 ID, .750 OD,	500
4534-832-AL-7 RAF	HEX STANDOFF #8-32 ALUMINUM 1/2"	1258
MTS-13 Richco, Inc. (Essentra Components)	HEX STANDOFF M3 NYLON 1/2"	2153
M2153-3005-S-12 RAF	6MM HEX X 18MM X M3 THD	170
CBMFTS285A Richco, Inc. (Essentra Components)	HEX STANDOFF M3 NYLON 17MM	704
CBSS105A Richco, Inc. (Essentra Components)	SELF RETAINING SPACER, .234 IN T	1584
970070324 Würth Elektronik Midcom	BRASS SPACER STUD METRIC THREAD	3453
M2167-4007-SS RAF	6MM HEX X 46MM X M4 THD	340

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production