Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
2113-632-SS RAF	1/4 HEX X 1-1/16 LENGTH	159
1233-25-N RAF	1/2 RD X 1 1/4 X .252 ID	200
M1313-3005-SS RAF	HEX STANDOFF M3X0.5 SS 16MM	80
1682-832-SS RAF	1/4 RD X 3/8 LENGTH	400
13RSSR0227 Richco, Inc. (Essentra Components)	ROUND SPACER, .380 ID, .750 OD,	1499
13SP199 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	3000
4506T-440-SS RAF	3/16 HEX X 19/32 LENGTH	206
1127-6-AL-7 RAF	1/4 RD X 7/16 X .140 ID	1500
NAS1829AC4E09 RAF	ALUMINUM 1/4 HEX MALE/FEMALE STA	0
R30-6010802 Harwin	ROUND SPACER M3 BRASS 8MM	602
24310 Keystone Electronics Corp.	HEX STNDFF M2.5X0.45 BRASS 18MM	144200
960140042 Würth Elektronik Midcom	ROUND PLASTIC SPACER L:14,0 MM	500
M0599-5-N RAF	ROUND SPACER NYLON 10MM	1568
13RS098528 Richco, Inc. (Essentra Components)	ROUND SPACER, .285 ID, .985 OD,	2000
M2101-3005-AL RAF	HEX STANDOFF M3X0.5 ALUMINUM 6MM	0
1103-2-SS RAF	1/8 RD X 5/16 X .090 ID	1500
13SP180 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	6400
1816-1032-AL RAF	3/8 RD X 3/8 LENGTH	400
1690-440-AL RAF	1/4_ROUND_FEMALE_STANDOFFS	1170
2305-2520-S-12 RAF	1/2 HEX X 1/2 LENGTH	475

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production