Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
782853221 Würth Elektronik Midcom	FERRITE BEAD 220 OHM 0805 1LN	3293
7427925 Würth Elektronik Midcom	WE-CBF SMT EMI SUPPRESSION FERRI	1300
74273001 Würth Elektronik Midcom	FERRITE BEAD 264 OHM RADIAL 3LN	132
7427927140 Würth Elektronik Midcom	FERRITE BEAD 47 OHM 0402 1LN	2150
742792621 Würth Elektronik Midcom	FERRITE BEAD 140 OHM 0603 1LN	5310
7427920415 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0805 1LN	12099
742792653 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0603 1LN	18462
74279243 Würth Elektronik Midcom	WE-CBF SMT EMI SUPPRESSION FERRI	3011
7427927370 Würth Elektronik Midcom	FERRITE BEAD 70 OHM 0402 1LN	9830
742862160 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0603 1LN	3731
742792624 Würth Elektronik Midcom	FERRITE BEAD 180 OHM 0603 1LN	11333
782631331 Würth Elektronik Midcom	FERRITE BEAD 330 OHM 0603 1LN	2590
7427927241 Würth Elektronik Midcom	FERRITE BEAD 470 OHM 0402 1LN	6333
742792150 Würth Elektronik Midcom	FERRITE BEAD 80 OHM 1206 1LN	0
74279228111 Würth Elektronik Midcom	FERRITE BEAD 110 OHM 0603 1LN	9530
742861210 Würth Elektronik Midcom	FERRITE BEAD 1 KOHM 0603 1LN	1709
742792642 Würth Elektronik Midcom	FERRITE BEAD 470 OHM 0603 1LN	19642
742692005 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 0201 1LN	6322
742730021 Würth Elektronik Midcom	FERRITE BEAD 170 OHM RADIAL 4LN	0
7427927115 Würth Elektronik Midcom	FERRITE BEAD 150 OHM 0402 1LN	18496

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems