Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
742792032 Würth Elektronik Midcom	FERRITE BEAD 400 OHM 0805 1LN	7490
74275043 Würth Elektronik Midcom	WE-UKW EMI SUPPRESSION 6-HOLE FE	0
74279271 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0402 1LN	19373
742841210 Würth Elektronik Midcom	FERRITE BEAD 1 KOHM 0402 1LN	37357
74279224101 Würth Elektronik Midcom	FERRITE BEAD 100 OHM 2220 1LN	1981
74279264 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 0603 1LN	6233
74279202 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0805 1LN	13624
782853152 Würth Elektronik Midcom	FERRITE BEAD 1.5 KOHM 0805 1LN	13257
74279226101 Würth Elektronik Midcom	FERRITE BEAD 100 OHM 1812 1LN	29717
742792312 Würth Elektronik Midcom	FERRITE BEAD 65 OHM 1210 1LN	463
7427927291 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0402 1LN	58921
742792040 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0805 1LN	70355
74279201 Würth Elektronik Midcom	FERRITE BEAD 32 OHM 0805 1LN	1348
742792005 Würth Elektronik Midcom	FERRITE BEAD 5 OHM 0805 1LN	2026
742792691 Würth Elektronik Midcom	FERRITE BEAD 1.5 KOHM 0603 1LN	3475
74279244 Würth Elektronik Midcom	FERRITE BEAD 850 OHM 1806 1LN	9148
742792693 Würth Elektronik Midcom	FERRITE BEAD 2.2 KOHM 0603 1LN	21326
74279224551 Würth Elektronik Midcom	FERRITE BEAD 550 OHM 2220 1LN	2956
7427927310 Würth Elektronik Midcom	FERRITE BEAD 10 OHM 0402 1LN	8022
782631222 Würth Elektronik Midcom	FERRITE BEAD 2.2 KOHM 0603 1LN	2937

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems