Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
782422331 Würth Elektronik Midcom	FERRITE BEAD 330 OHM 0402 1LN	7859
782423100 Würth Elektronik Midcom	FERRITE BEAD 10 OHM 0402 1LN	8630
74279224271 Würth Elektronik Midcom	FERRITE BEAD 270 OHM 2220 1LN	1139
74279262 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0603 1LN	27323
7427927112 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0402 1LN	34627
742792097 Würth Elektronik Midcom	FERRITE BEAD 1.5 KOHM 0805 1LN	65483
742792111 Würth Elektronik Midcom	FERRITE BEAD 26 OHM 1206 1LN	11666
7427927281 Würth Elektronik Midcom	FERRITE BEAD 800 OHM 0402 1LN	6039
74279267 Würth Elektronik Midcom	FERRITE BEAD 60 OHM 0603 1LN	20265
742792092 Würth Elektronik Midcom	FERRITE BEAD 2 KOHM 0805 1LN	1580
742792515 Würth Elektronik Midcom	FERRITE BEAD 785 OHM 1812 1LN	158883
742692003 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0201 1LN	2590
742841160 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0402 1LN	29538
742792116 Würth Elektronik Midcom	FERRITE BEAD 500 OHM 1206 1LN	24996
742792045 Würth Elektronik Midcom	FERRITE BEAD 750 OHM 0805 1LN	3832
7427930 Würth Elektronik Midcom	FERRITE BEAD 42 OHM 2SMD 1LN	14496
7427929112 Würth Elektronik Midcom	FERRITE BEAD 200 OHM 2SMD 1LN	98
74279221111 Würth Elektronik Midcom	FERRITE BEAD 110 OHM 1206 1LN	6562
742792662 Würth Elektronik Midcom	FERRITE BEAD 1 KOHM 0603 1LN	123355
74275223 Würth Elektronik Midcom	FERRITE BEAD 1.24 KOHM RAD 1LN	170

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems