Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MMZ0603F330CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	29965
HF70ACB453215-T TDK Corporation	FERRITE BEAD 120 OHM 1812 1LN	12000
MPZ1005A151ETD25 TDK Corporation	CHIP BEADS FOR POWER LINE, FOR A	11951
MMZ0603D330CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
MPZ1608S260ATAH0 TDK Corporation	FERRITE BEAD 26 OHM 0603 1LN	4629
MMZ1608D241CTA00 TDK Corporation	FERRITE BEAD 240 OHM 0603 1LN	6970
HF50ACB453215-TD25 TDK Corporation	FERRITE BEAD 125 OHM 1812 1LN	970
MAF1005GAD152AT000 TDK Corporation	FERRITE BEAD 200 OHM 0402 1LN	28491
MPZ2012S102ATD25 TDK Corporation	FERRITE BEAD 1 KOHM 0805 1LN	0
MMZ0603S241HT000 TDK Corporation	FERRITE BEAD 240 OHM 0201 1LN	0
MMZ1005S102CTD25 TDK Corporation	FERRITE BEAD 1 KOHM 0402 1LN	26780
MMZ1608S471ATA00 TDK Corporation	FERRITE BEAD 470 OHM 0603 1LN	2168
HF30ACC575018-T TDK Corporation	FERRITE CHIP 100 OHM 3A SMD	0
MMZ1005B121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	54900
HF50ACB321611-TD25 TDK Corporation	FERRITE BEAD 31 OHM 1206 1LN	2931
MMZ0603AFY560VT000 TDK Corporation	FERRITE BEAD 56 OHM 0201 1LN	1150
MMZ0603D800CT000 TDK Corporation	FERRITE BEAD 80 OHM 0201 1LN	6195
MMZ1005F470CTD25 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	19376
MMZ1608Y601CTAH0 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	14302
MMZ1608R471ATD25 TDK Corporation	FERRITE BEAD 470 OHM 0603 1LN	14000

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems