Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MMZ1608A252BTA00 TDK Corporation	FERRITE BEAD 2.5 KOHM 0603 1LN	57246
MPZ1005F470ET000 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	3641
MMZ1005F750ET000 TDK Corporation	FERRITE BEAD 75 OHM 0402 1LN	13980
MMZ0402S700CT000 TDK Corporation	FERRITE BEAD 70 OHM 01005 1LN	17423
MPZ1005D750ET000 TDK Corporation	FERRITE BEAD 75 OHM 0402 1LN	0
MMZ2012S400AT000 TDK Corporation	FERRITE BEAD 40 OHM 0805 1LN	10847
MMZ1608Y102BTA00 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	10661
MMZ1608D121BTA00 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	13301
MMZ0603Y121CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	29950
HF70ACB201209-TD25 TDK Corporation	FERRITE BEAD 10 OHM 0805 1LN	0
MMZ2012S121AT000 TDK Corporation	FERRITE BEAD 120 OHM 0805 1LN	88
MAF1005GAD251DT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	15460
MMZ1005S102HT000 TDK Corporation	FERRITE BEAD 1 KOHM 0402 1LN	36497
MMZ1608S202ATA00 TDK Corporation	FERRITE BEAD 2 KOHM 0603 1LN	128323
MMZ1608D301BTA00 TDK Corporation	FERRITE BEAD 300 OHM 0603 1LN	83217
VFS6045VA201 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2500
MMZ1608D800BTA00 TDK Corporation	FERRITE BEAD 80 OHM 0603 1LN	13745
MMZ0603S601ET000 TDK Corporation	FERRITE BEAD 600 OHM 0201 1LN	18059
MMZ1005S601CT000 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	256655
HF70ACB321611-TD25 TDK Corporation	FERRITE BEAD 26 OHM 1206 1LN	770

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems