Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MPZ2012S331AT000 TDK Corporation	FERRITE BEAD 330 OHM 0805 1LN	0
MMZ1005A152ETD25 TDK Corporation	FERRITE BEAD 1.5 KOHM 0402 1LN	2432
HF30ACC635050-T TDK Corporation	FERRITE BEAD 750 OHM 2520 1LN	600
MPZ1608B471ATA00 TDK Corporation	FERRITE BEAD 470 OHM 0603 1LN	99169
MMZ0603D121CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
MMZ1608F470BTA00 TDK Corporation	FERRITE BEAD 47 OHM 0603 1LN	4000
MPZ1608D101BTD25 TDK Corporation	FERRITE BEAD 100 OHM 0603 1LN	96932
HF30ACC321611-T TDK Corporation	FERRITE BEAD 19 OHM 1206 1LN	8410
MAF1005GAD262AT000 TDK Corporation	FERRITE BEAD 400 OHM 0402 1LN	92877
MMZ1005F470ET000 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	32885
MMZ1005A601ET000 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	23451
MMZ0603Y750CT000 TDK Corporation	FERRITE BEAD 75 OHM 0201 1LN	14025
MPZ0603S121HT000 TDK Corporation	CHIP BEADS FOR GENERAL SIGNAL LI	1488
MMZ1608D050CTD25 TDK Corporation	FERRITE BEAD 5 OHM 0603 1LN	1949
MMZ0603S471CT000 TDK Corporation	FERRITE BEAD 470 OHM 0201 1LN	10
MMZ0603A241ET000 TDK Corporation	FERRITE BEAD 240 OHM 0201 1LN	19265
MMZ0603S601ET TDK Corporation	FERRITE BEAD 600 OHM 0201 1LN	0
VFS5045VA301 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2919
MMZ0603D121ET000 TDK Corporation	FERRITE BEAD 120 OHM 0201 1LN	1074
MMZ1608D100CTAH0 TDK Corporation	FERRITE BEAD 10 OHM 0603 1LN	23988

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems