Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MFBW1V1608-050-R PowerStor (Eaton)	FIXED IND 5 1000MA 0603	0
Z0603C600BPWZT KEMET	POWER LINE HIGH IMPEDANCE FERRIT	3830
GMLB-160808-1000L-N8A-RU Mag Layers	FERRITE BEAD 1K OHM 0603 1LN	52000
NFZ32BW3R6HN10L TOKO / Murata	FERRITE BEAD 3.6 OHM 2SMD 1LN	0
BLM21PG220SN1D TOKO / Murata	FERRITE BEAD 22 OHM 0805 1LN	97128
HF50ACC201209-TD25 TDK Corporation	FERRITE BEAD 11 OHM 0805 1LN	914
FBTH1608HE101-T TAIYO YUDEN	FERRITE BEAD,HIGH CURRENT, 0603	7867
BLM03BB470SN1D TOKO / Murata	FERRITE BEAD 47 OHM 0201 1LN	454
Z0603C331CSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	4000
ILB1206ER151V Vishay / Dale	FERRITE BEAD 150 OHM 1206 1LN	5934
BL02RN2R1P1A TOKO / Murata	FERRITE BEAD AXIAL 1LN	0
FBMJ4516HS111-T TAIYO YUDEN	FERRITE BEAD 110 OHM 1806 1LN	34633
MH2029-121Y J.W. Miller / Bourns	FERRITE BEAD 120 OHM 0805 1LN	18134
7427927291 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0402 1LN	58921
MMZ1608F470BTD25 TDK Corporation	FERRITE BEAD 47 OHM 0603 1LN	11445
MPZ1608S601ATA00 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	0
MMZ0603F560ET000 TDK Corporation	FERRITE BEAD 56 OHM 0201 1LN	13906
BLM18TG121TN1D TOKO / Murata	FERRITE BEAD 120 OHM 0603 1LN	10269
CIM10U800NC Samsung Electro-Mechanics	FERRITE BEAD 80 OHM 0603 1LN	801
MFBW1V3216-150-R PowerStor (Eaton)	FIXED IND 15 3000MA 1206	1000

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems