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Ferrite Beads and Chips

Image Part Number Description / PDF Quantity Rfq
782853152

782853152

Würth Elektronik Midcom

FERRITE BEAD 1.5 KOHM 0805 1LN

13257
MMZ1608D800BTD25

MMZ1608D800BTD25

TDK Corporation

FERRITE BEAD 80 OHM 0603 1LN

1810
Z0805C220ASMST

Z0805C220ASMST

KEMET

SIGNAL LINE EMI FERRITE CHIP BEA

3495
MMZ1608Y221BTA00

MMZ1608Y221BTA00

TDK Corporation

FERRITE BEAD 220 OHM 0603 1LN

91
BK1608HS800-T

BK1608HS800-T

TAIYO YUDEN

FERRITE BEAD 80 OHM 0603 1LN

0
MMZ1608Y121BTD25

MMZ1608Y121BTD25

TDK Corporation

FERRITE BEAD 120 OHM 0603 1LN

3550
MMZ1005S241HT000

MMZ1005S241HT000

TDK Corporation

FERRITE BEAD 240 OHM 0402 1LN

6920
BLM21BD182SN1D

BLM21BD182SN1D

TOKO / Murata

FERRITE BEAD 1.8 KOHM 0805 1LN

25078
74279226101

74279226101

Würth Elektronik Midcom

FERRITE BEAD 100 OHM 1812 1LN

29717
MMZ0402EUC181CTF0W

MMZ0402EUC181CTF0W

TDK Corporation

FERRITE BEAD 180 OHM 01005 1LN

39430
LI0402C221R-10

LI0402C221R-10

Laird - Performance Materials

FERRITE BEAD 220 OHM 0402 1LN

14102
BLM18BD252SN1D

BLM18BD252SN1D

TOKO / Murata

FERRITE BEAD 2.5 KOHM 0603 1LN

173089
BK1005LM182-T

BK1005LM182-T

TAIYO YUDEN

FERRITE BEAD 1.8 KOHM 0402 1LN

0
742792312

742792312

Würth Elektronik Midcom

FERRITE BEAD 65 OHM 1210 1LN

463
LB4X2X8U

LB4X2X8U

Toshiba Electronic Devices and Storage Corporation

FERRITE BEAD AXIAL 1LN

914
BLM15BX102SN1D

BLM15BX102SN1D

TOKO / Murata

FERRITE BEAD 1 KOHM 0402 1LN

8831
BLM31KN271BH1L

BLM31KN271BH1L

TOKO / Murata

270OHM DCR MAX 3) A RATED CURREN

45
KMZ1608YHR102BTD25

KMZ1608YHR102BTD25

TDK Corporation

FERRITE BEAD 1 KOHM 0603 1LN

5705
FBMH1608HM101-T

FBMH1608HM101-T

TAIYO YUDEN

FERRITE BEAD 100 OHM 0603 1LN

173744
VAF201610FA-131-1

VAF201610FA-131-1

TDK Corporation

NOISE SUPPRESSION FILTER FOR AUD

1895

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Frequency Ferrite BeadsOptimized for GHz-range noise suppression, low core loss5G transceivers, RF modules
Low-Frequency Ferrite BeadsEffective at MHz-range filtering, high impedance stabilityPower supplies, motor drives
High-Current ChipsDesigned for >1A applications, thermal stabilityEV battery management systems
Multilayer Ferrite ChipsStacked structure for broadband filteringSmartphones, IoT devices

3. Structure and Composition

Typical construction includes:

  • Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
  • Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
  • Encapsulation: Epoxy or polymer coating for mechanical protection
  • Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

ParameterDescriptionImportance
Impedance (Z)100MHz @ 100 -10k Determines noise suppression efficiency
Rated Current100mA-10AAffects circuit stability under load
Frequency Range1MHz-10GHzDefines operational bandwidth
DC Resistance (DCR)0.1 -20 Impacts power loss and heating
Operating Temp.-55 C to +150 CEnsures reliability in extreme conditions

5. Application Areas

  • Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
  • Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
  • Industrial: PLCs (programmable logic controllers), motor drives
  • Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecifications
MurataBLSH series0.7A, 600 @ 100MHz, EIA 0603
TDKMMZ series3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft0603LS series1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik744300 series2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

  1. Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
  2. Calculate current requirements: Select rated current 20% higher than maximum operating current
  3. Impedance matching: Ensure Z 10 source/load impedance at target frequency
  4. Package constraints: Prioritize chip format for space-limited PCB designs
  5. Environmental factors: Consider temperature rating for automotive/industrial applications
  6. Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

  • Miniaturization: Development of 0201/01005 chip sizes for wearable devices
  • High-frequency performance: Materials enabling stable operation beyond 10GHz
  • Integrated solutions: Combining ferrite beads with capacitors in single packages
  • Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
  • Automotive focus: AEC-Q qualified parts for EV/HEV power systems
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