Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
74279264 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 0603 1LN	6233
BK1005HM102-TV TAIYO YUDEN	FERRITE BEAD 1 KOHM 0402 1LN	7520
MPZ1608D300BTD25 TDK Corporation	FERRITE BEAD 30 OHM 0603 1LN	0
VFS6045SA102 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2965
BLM15EG221SH1D TOKO / Murata	FERRITE BEAD 220 OHM 0402 1LN	9743
BMB2A1000BN7 TE Connectivity AMP Connectors	FERRITE BEAD 0805 1LN	3945
MMZ1005F470CT000 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	5108
MPZ1005S900HT000 TDK Corporation	FERRITE BEAD 90 OHM 0402 1LN	34091
MFBM1V2012-121-R PowerStor (Eaton)	FIXED IND 120 3000MA 0805	0
MFBW1V3216-110-R PowerStor (Eaton)	FIXED IND 11 4000MA 1206	0
BLM31PG330SH1L TOKO / Murata	FERRITE BEAD 33 OHM 1206 1LN	8521
BK1608LM152-T TAIYO YUDEN	FERRITE BEAD 1.5 KOHM 0603 1LN	2885
MFBM1V1608-000-R PowerStor (Eaton)	FIXED IND 0 6000MA 0603	980
NFZ15SG771SN10D TOKO / Murata	0402 (1005) 770OHM (TYP.) 500MA	9657
KPZ1608SHR601ATD25 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	2117
BLM21SP601SN1D TOKO / Murata	FERRITEBEAD SMD Z100MHZ=600OHM 2	4607
MMZ1608S102ATD25 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	1532
HF50ACC575018-T TDK Corporation	FERRITE BEAD 180 OHM 2220 1LN	936
MFBW1V3216-102-R PowerStor (Eaton)	FIXED IND 1000 2000MA 1206	0
ACML-0805-500-T Abracon	FERRITE BEAD 50 OHM 0805 1LN	1940

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems