Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
HZ0603C651R-10 Laird - Performance Materials	FERRITE BEAD 650 OHM 0603 1LN	43983
Z0603C601BPWZT KEMET	POWER LINE HIGH IMPEDANCE FERRIT	3480
742792625 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0603 1LN	0
BK1608HM471-T TAIYO YUDEN	FERRITE BEAD 470 OHM 0603 1LN	3630
BLM15PX600SN1D TOKO / Murata	FERRITE BEAD 60 OHM 0402 1LN	70720
ILBB0402ER300V Vishay / Dale	FERRITE BEAD 30 OHM 0402 1LN	0
BLM18GG471SZ1D TOKO / Murata	FERRITE BEAD 470 OHM 0603 1LN	104
MFBW1V3216-050-R PowerStor (Eaton)	FIXED IND 5 4000MA 1206	0
2506036017Y0 Fair-Rite Products Corp.	FERRITE BEAD 0603 1LN	104364
742792042 Würth Elektronik Midcom	FERRITE BEAD 600 OHM 0805 1LN	11706
MAF1608FAD121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	509
MMZ0603Y750CT TDK Corporation	FERRITE BEAD 75 OHM 0201 1LN	0
NFZ32BW111HN10L TOKO / Murata	FERRITE BEAD 110 OHM 2SMD 1LN	37
HZ0603D102R-10 Laird - Performance Materials	FERRITE BEAD 1 KOHM 0603 1LN	0
HZ0603C152R-10 Laird - Performance Materials	FERRITE BEAD 1.5 KOHM 0603 1LN	0
SMB2.5R-1 API Delevan	FERRITE BEAD 385 OHM 2SMD 1LN	7113
DA1206E300R-10 Laird - Performance Materials	FERRITE BEAD 30 OHM 1206 4LN	0
CIC10J601NC Samsung Electro-Mechanics	FERRITE BEAD 600 OHM 0603 1LN	8
HF50ACB201209-TD25 TDK Corporation	FERRITE BEAD 11 OHM 0805 1LN	2930
Z0805C601BSMST KEMET	FERRITE BEAD 600 OHM 0805 1LN	2487

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems