Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
BK32164W121-T TAIYO YUDEN	FERRITE BEAD 120 OHM 1206 4LN	0
MMZ1005Y241CT000 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	159342
742792903 Würth Elektronik Midcom	FERRITE BEAD 340 OHM 2SMD 1LN	2946
MMZ2012S151AT000 TDK Corporation	FERRITE BEAD 150 OHM 0805 1LN	0
MPZ0603S330CT000 TDK Corporation	FERRITE BEAD 33 OHM 0201 1LN	19857
74279203 Würth Elektronik Midcom	FERRITE BEAD 150 OHM 0805 1LN	3249
2506038007Y0 Fair-Rite Products Corp.	FERRITE BEAD 0603 1LN	4228
BK0603LL470-T TAIYO YUDEN	FERRITE BEAD 47 OHM 0201 1LN	3147
MMZ1608D301BTD25 TDK Corporation	FERRITE BEAD 300 OHM 0603 1LN	16
BLM41PG471SN1L TOKO / Murata	FERRITE BEAD 470 OHM 1806 1LN	6633
742792645 Würth Elektronik Midcom	FERRITE BEAD 470 OHM 0603 1LN	43033
MMZ1005D100CT000 TDK Corporation	FERRITE BEAD 10 OHM 0402 1LN	9115
ACML-1206-600-T (3K/REEL) Abracon	FERRITE BEAD 60 OHM 1206	0
NFZ2MSD301SZ10L TOKO / Murata	EMI FILTER SMD 300OHM INFOTMT, A	2072
BLM18AG331SN1D TOKO / Murata	FERRITE BEAD 330 OHM 0603 1LN	32387
742792113 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 1206 1LN	84168
Z0603C151BPWZT KEMET	POWER LINE HIGH IMPEDANCE FERRIT	3965
BBUP00160808300Y00 Chilisin Electronics	EMI BEAD FILETER	7772
MPZ1005S300CTD25 TDK Corporation	FERRITE BEAD 30 OHM 0402 1LN	13055
BLA31AG221SN4D TOKO / Murata	FERRITE BEAD 220 OHM 1206 4LN	2145

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems