Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
FBMH2012HM221-T TAIYO YUDEN	FERRITE BEAD 220 OHM 0805 1LN	15795
2512067008Y0 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0
ILB1206ER600V Vishay / Dale	FERRITE BEAD 60 OHM 1206 1LN	2682
HZ0603A252R-10 Laird - Performance Materials	FERRITE BEAD 2.5 KOHM 0603 1LN	3376
MH2029-300Y J.W. Miller / Bourns	FERRITE BEAD 30 OHM 0805 1LN	64797
BK2125LL241-T TAIYO YUDEN	FERRITE BEAD 240 OHM 0805 1LN	3890
NFZ32BW520HN11L TOKO / Murata	FERRITE BEAD 52 OHM 2SMD 1LN	0
ILHB1206ER750V Vishay / Dale	FERRITE BEAD 75 OHM 1206 1LN	1634
MMZ0603D560CT000 TDK Corporation	FERRITE BEAD 56 OHM 0201 1LN	41824
BLM31KN102SN1L TOKO / Murata	FERRITE BEAD 1 KOHM 1206 1LN	5044
BLM15PX330SZ1D TOKO / Murata	FERRITE BEAD 33 OHM 0402 1LN	4803
MMZ1608Q601BTD25 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	2171
ACML-0402-310-T Abracon	FERRITE BEAD 31 OHM 0402 1LN	0
NFZ32BW120HN11L TOKO / Murata	FERRITE BEAD 12 OHM 2SMD 1LN	996
BBPY00160808100Y00 Chilisin Electronics	EMI BEAD FILETER	3284
MMZ1005D121ETD25 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	6140
Z0603C600GPWZT KEMET	POWER LINE HIGH IMPEDANCE FERRIT	3674
MMZ1608S202ATD25 TDK Corporation	FERRITE BEAD 2 KOHM 0603 1LN	0
FBMJ1608HM230NTR TAIYO YUDEN	FERRITE BEAD 23 OHM 0603 1LN	7370
74279274 Würth Elektronik Midcom	FERRITE BEAD 30 OHM 0402 1LN	11332

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems