Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
BLM21AG601SZ1D TOKO / Murata	FERRITE BEAD 600 OHM 0805 1LN	1394
MMZ1608S601ATA00 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	0
BBPY00201209152Y00 Chilisin Electronics	EMI BEAD FILETER	647
MPZ1608Y221BTD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	11600
ILB1206ER201V Vishay / Dale	FERRITE BEAD 200 OHM 1206 1LN	0
NFZ2MSD900SN10L TOKO / Murata	EMI FILTER SMD NONAUTO, SMD 2016	2724
ILBB0603ER181V Vishay / Dale	FERRITE BEAD 180 OHM 0603 1LN	0
74279219 Würth Elektronik Midcom	FERRITE BEAD 700 OHM 1206 1LN	16065
BLM31KN471SZ1L TOKO / Murata	FERRITE BEAD 470 OHM 1206 1LN	47130
BBBK00160808300Y00 Chilisin Electronics	EMI BEAD FILETER	8000
2961666661 Fair-Rite Products Corp.	FERRITE BEAD RADIAL 1LN	1727
ACML-0201-601-T Abracon	FERRITE BEAD 600 OHM 0201 1LN	0
742792640 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 0603 1LN	27215
MMZ2012Y301BT000 TDK Corporation	FERRITE BEAD 300 OHM 0805 1LN	10375
Z0603C330APMST KEMET	FERRITE BEAD 33 OHM 0603 1LN	4846
2512066018Y1 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0
2673004701 Fair-Rite Products Corp.	FERRITE BEAD	11350
BLM03HB191SN1D TOKO / Murata	FERRITE BEAD 190 OHM 0201 1LN	75066
MAF1005GAD571DT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	8745
BK0603TS800-TV TAIYO YUDEN	FERRITE BEAD 80 OHM 0201 1LN	29900

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems