Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
BLM18BA050SN1D TOKO / Murata	FERRITE BEAD 5 OHM 0603 1LN	13585
BLM18AG121SZ1D TOKO / Murata	FERRITE BEAD 120 OHM 0201 1LN	10870
2504021007Y0 Fair-Rite Products Corp.	FERRITE BEAD 0402 1LN	8738
FBMJ4516HM900-T TAIYO YUDEN	FERRITE BEAD 90 OHM 1806 1LN	2212
BK1005HM241-TV TAIYO YUDEN	FERRITE BEAD 240 OHM 0402 1LN	0
BLM21AG151SN1D TOKO / Murata	FERRITE BEAD 150 OHM 0805 1LN	31907
74275243 Würth Elektronik Midcom	FERRITE BEAD 961 OHM RADIAL 1LN	128
BLE18PS080SN1D TOKO / Murata	FERRITE BEAD	0
BLM18AG102SN1D TOKO / Murata	FERRITE BEAD 1 KOHM 0603 1LN	489835
BLA2ABD750SN4D TOKO / Murata	FERRITE BEAD 75 OHM 0804 4LN	0
MMZ1005F470ETD25 TDK Corporation	FERRITE BEAD 47 OHM 0402 1LN	9965
2512065007Y0 Fair-Rite Products Corp.	FERRITE BEAD 1206 1LN	3000
LI0805H750R-10 Laird - Performance Materials	FERRITE BEAD 75 OHM 0805 1LN	12502
28L0138-80R-10 Laird - Performance Materials	FERRITE BEAD 86 OHM AXIAL 1LN	107851
MMZ0603S241HTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
782763820 Würth Elektronik Midcom	FERRITE BEAD 82 OHM 1206 1LN	10759
742792023 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0805 1LN	115851
74279215 Würth Elektronik Midcom	FERRITE BEAD 80 OHM 1206 1LN	20839
74279252 Würth Elektronik Midcom	WE-CBF SMT EMI SUPPRESSION FERRI	11387
BK1005HM750-TV TAIYO YUDEN	FERRITE BEAD 75 OHM 0402 1LN	10000

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems