Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
Z0402C100CSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	10000
742792091 Würth Elektronik Midcom	FERRITE BEAD 1.5 KOHM 0805 1LN	4000
FBMJ3216HM380NT TAIYO YUDEN	FERRITE BEAD 38 OHM 1206 1LN	18793
FBMH1608HM471-TV TAIYO YUDEN	FERRITE BEAD 470 OHM 0603 1LN	1370
Z0402C121BPMST KEMET	POWER LINE FERRITE CHIP BEAD 120	10000
PE-0402FB100XT PulseLarsen Antenna	FERRITE BEAD 0402 1LN	0
BLM15BB750SN1D TOKO / Murata	FERRITE BEAD 75 OHM 0402 1LN	10521
MMZ1005S241CTD25 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	9571
NFZ2MSD101SZ10L TOKO / Murata	EMI FILTER SMD 100OHM INFOTMT, A	2568
BLM18AG102SH1D TOKO / Murata	FERRITE BEAD 1 KOHM 0603 1LN	64445
B-6-22B KEMET	BEAD (WINDING) 2A	500
MU2029-600Y J.W. Miller / Bourns	FERRITE BEAD 60 OHM 0805 1LN	0
GMLB-160808-0600L-N8-RU Mag Layers	MULTILAYER BEAD	100000
742692004 Würth Elektronik Midcom	FERRITE BEAD 240 OHM 0201 1LN	6708
FBMJ3216HS800-T TAIYO YUDEN	FERRITE BEAD 80 OHM 1206 1LN	23030
74279224151 Würth Elektronik Midcom	FERRITE BEAD 150 OHM 2220 1LN	1000
HF70ACC453215-T TDK Corporation	FERRITE BEAD 120 OHM 1812 1LN	1488
MMZ1005AFZ151VT000 TDK Corporation	FERRITE BEAD 150 OHM 0402 1LN	4538
ACML-0805-190-T Abracon	FERRITE BEAD 19 OHM 0805 1LN	0
BLM18KG700JH1D TOKO / Murata	FERRITE BEAD 70 OHM 0603 1 LN	4000

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems