Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
56995-501

56995-501

Laird Thermal Systems

PELTIER MODULE CP2,31,10,L1,W4.5

13

7950004-601

7950004-601

Laird Thermal Systems

PELTIER MOD ZT4,12,F1,4040,TA,W8

494

387004956

387004956

Laird Thermal Systems

ETX4-6-F2-2143-TA-RT-W6

0

387003592

387003592

Laird Thermal Systems

UT15-288-F2-5252-TB-RT-W6

8

430141-512

430141-512

Laird Thermal Systems

PELTIER MOD HT4,12,F2,4040,TA,W6

12

387001816

387001816

Laird Thermal Systems

ET15,65,F2A,1312,11,W2.25

0

9340005-301

9340005-301

Laird Thermal Systems

PELTIER MS4,129,10,15,11,W8

3

430759-509

430759-509

Laird Thermal Systems

PELTIER UT11,12,F2,3030,TA,W6

0

387004934

387004934

Laird Thermal Systems

ETX8-12-F2-2525-TA-RT-W6

40

16505-302

16505-302

Laird Thermal Systems

PELTIR MS2,190,10,13,08,20,11,W8

7

387004689

387004689

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

387004724

387004724

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

8

63205-501

63205-501

Laird Thermal Systems

PELTIER MOD CP10,127,08,L1,W4.5

4

387004955

387004955

Laird Thermal Systems

ETX8-7-F2-3030-TA-RT-W6

20

387001838

387001838

Laird Thermal Systems

ET6,7,F2,3030,TA,RT,W6

0

430134-516

430134-516

Laird Thermal Systems

PELTIER MOD HT9,3,F2,2525,TA,W6

42

430436-504

430436-504

Laird Thermal Systems

PELTIER MODULE CP10,71,06,L,W4.5

36

387004926

387004926

Laird Thermal Systems

ETX14-3-F1-3030-TB-EP-W6

11

387001794

387001794

Laird Thermal Systems

ET5,6,F1,2040,TA,RT,W6

30

430039-510

430039-510

Laird Thermal Systems

PELTR HOT20,31,F2A,0909,GG,W2.25

39

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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