Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
71063-505

71063-505

Laird Thermal Systems

PELTIER RH14,14,06,L1,W4.5

8

387001826

387001826

Laird Thermal Systems

ET8,28,F2,5252,TA,RT,W6

16

9340001-304

9340001-304

Laird Thermal Systems

PELTIR MS2,049,10,10,15,15,00,W8

6

387004727

387004727

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

64975-502

64975-502

Laird Thermal Systems

PELTIER CP2,127,10,L,RT,W4.5

462

430848-506

430848-506

Laird Thermal Systems

PELTIER CP12,161,06,L1,RT,W4.5

15

9350001-304

9350001-304

Laird Thermal Systems

PELTIR MS2,049,14,14,15,15,00,W8

28

430687-502

430687-502

Laird Thermal Systems

PELTIR ET12,65,F2A,1312,11,W2.25

0

387004695

387004695

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

19

387004927

387004927

Laird Thermal Systems

ETX15-12-F2-4040-TA-RT-W6

0

56430-510

56430-510

Laird Thermal Systems

CP10-63-05-L1-RT-W4.5

4

387004941

387004941

Laird Thermal Systems

ETX4-7-F1-2323-TA-RT-W6

36

9340004-304

9340004-304

Laird Thermal Systems

PELTIER MS3,231,10,15,00,W8

17

430002-501

430002-501

Laird Thermal Systems

PELTIER OT08,18,F0,0505,11,W2.25

0

430285-512

430285-512

Laird Thermal Systems

PELTIER HT6,12,F2,4040,TB,RT,W6

6

387001748

387001748

Laird Thermal Systems

ET2.6,6,F1,1225,TA,RT,W6

34

9350004-301

9350004-301

Laird Thermal Systems

MS3,119,14,15,11,W8

1

387004683

387004683

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

34

43240-501

43240-501

Laird Thermal Systems

PELTIER CP10,17,06,L,W4.5

97

56995-503

56995-503

Laird Thermal Systems

PELTIER CP2,31,10,L1,RT,W4.5

21

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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