Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
430779-502

430779-502

Laird Thermal Systems

PELTIR OT12,18,F2A,0606,GG,W2.25

39

16068-304

16068-304

Laird Thermal Systems

PELTIER MS3,052,10,17,00,W8

33

430078-525

430078-525

Laird Thermal Systems

PELTIER CP14,127,06,L1,EP,W4.5

27

475010-314

475010-314

Laird Thermal Systems

PELTIR MS2,102,14,14,17,17,00,W8

0

9350007-304

9350007-304

Laird Thermal Systems

PELTIR MS2,192,14,20,15,25,00,W8

0

387004965

387004965

Laird Thermal Systems

ETX4-12-F1-3030-TA-EP-W6

30

9340004-301

9340004-301

Laird Thermal Systems

PELTIER MS3,231,10,15,11,W8

10

430855-500

430855-500

Laird Thermal Systems

PELTIER UT8,288,F2,5252,TA,W6

60

45850-503

45850-503

Laird Thermal Systems

PELTIER OT08,08,F0,0303,GG,W2.25

40

108161070002

108161070002

Laird Thermal Systems

PC7,161,F1,4040,TA,RT,W6

75

9380001-301

9380001-301

Laird Thermal Systems

PELTIR MS2,065,04,04,11,11,11,W4

18

387004996

387004996

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

9350001-319

9350001-319

Laird Thermal Systems

MS2,049,14,14,15,15,21,W8

40

387004915

387004915

Laird Thermal Systems

ETX4-12-F1-4040-TA-RT-W6

15

430437-503

430437-503

Laird Thermal Systems

PELTIR ET19,35,F1N,0612,GG,W2.25

13

430856-501

430856-501

Laird Thermal Systems

PELTIER UT15,200,F2,4040,TA,RTW6

4

16491-302

16491-302

Laird Thermal Systems

PELTIER MS2,94,10,10,13,13,11,W8

36

108161070003

108161070003

Laird Thermal Systems

PC7-16-F1-4040-TA-W6

17

387004716

387004716

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

0

387001746

387001746

Laird Thermal Systems

ET2,12,F2,3030,TA,RT,W6

18

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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