Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
NL1021T-01AC

NL1021T-01AC

Marlow Industries, Inc.

TEM 6.6X6.6X2.16MM

297

NL3040-01BC

NL3040-01BC

Marlow Industries, Inc.

MULTISTAGE TEM21.72X28.27X10.8MM

3

XLT6-4-01LS

XLT6-4-01LS

Marlow Industries, Inc.

TEM THERMOCYCLER23.5X23.5X3.33MM

769

PL105-7.5-40-01LS

PL105-7.5-40-01LS

Marlow Industries, Inc.

TEM 40X40X3.1MM

7

PL020-4-30-01LS

PL020-4-30-01LS

Marlow Industries, Inc.

TEM 29.69X29.69X4.7MM

1

NL2012T-01AC

NL2012T-01AC

Marlow Industries, Inc.

MULTISTAGE TEM 10.97X9.88X3.76MM

44

RC3-6-01LS

RC3-6-01LS

Marlow Industries, Inc.

TEM 20.1X20.1X3.91MM

589

XLT2427-03AC

XLT2427-03AC

Marlow Industries, Inc.

TEM THERMOCYCLER 16X72X2.67MM

387

PL036-4-30-01LS

PL036-4-30-01LS

Marlow Industries, Inc.

TEM 30X30X3.2MM

18

CM23-1.9-04AC

CM23-1.9-04AC

Marlow Industries, Inc.

TEM 8.18X6.02X1.65MM

45

NL4040-04BC

NL4040-04BC

Marlow Industries, Inc.

MULTISTAGE TEM21.72X28.27X14.1MM

2

NL1011T-01AC

NL1011T-01AC

Marlow Industries, Inc.

TEM 6.6X6.6X2.4MM

73

XLT2419-08AC

XLT2419-08AC

Marlow Industries, Inc.

TEM THERMOCYCLER 30X29.59X2.34MM

396

TR060-6.5-40-01LS

TR060-6.5-40-01LS

Marlow Industries, Inc.

TEM TRITON ICE 40.13X40.13X3.9MM

19

TG12-8-01LS

TG12-8-01LS

Marlow Industries, Inc.

TEG GENERATOR 40.13X40.13X3.53MM

66

XLT2416-04AC

XLT2416-04AC

Marlow Industries, Inc.

TEM THERMOCYCLER 25.4X25.4X3.8MM

48

TR060-6.5-40-03LS

TR060-6.5-40-03LS

Marlow Industries, Inc.

TEM TRITON ICE 40.13X40.13X3.9MM

2

LCC12-8-16LS

LCC12-8-16LS

Marlow Industries, Inc.

TEM THERMOCYCLER 40X40X3.94MM

4

RC6-4-01LS

RC6-4-01LS

Marlow Industries, Inc.

TEM 23.5X23.5X3.33MM

0

RC6-6-01S

RC6-6-01S

Marlow Industries, Inc.

TEM 30X30X3.91MM

55

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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