Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
RC3-8-01LS

RC3-8-01LS

Marlow Industries, Inc.

TEM 20.1X20.1X3.53MM

60

NL3026T-01AC

NL3026T-01AC

Marlow Industries, Inc.

MULTISTAGE TEM 8.79X8.79X5.94MM

1

LCC12-10-01LS

LCC12-10-01LS

Marlow Industries, Inc.

TEM THERMOCYCLER 40X40X3.84MM

4

NL1507-03AC

NL1507-03AC

Marlow Industries, Inc.

TEM14.33X11.28X2.43MM DIA4MM

25

XLT2422-01LS

XLT2422-01LS

Marlow Industries, Inc.

TEM THERMOCYCLER 30X30X3.33MM

88

NL1023T-01AC

NL1023T-01AC

Marlow Industries, Inc.

TEM 13.16X13.16X2.16MM

236

NL2021T-01AC

NL2021T-01AC

Marlow Industries, Inc.

MULTISTAGE TEM 6.6X6.6X3.78MM

16

NL2011T-01AC

NL2011T-01AC

Marlow Industries, Inc.

MULTISTAGE TEM 6.6X6.6X4.29MM

7

RC3-4-01

RC3-4-01

Marlow Industries, Inc.

TEM 16X16X3.33MM

63

CM35-1.9-01AC

CM35-1.9-01AC

Marlow Industries, Inc.

TEM 12.19X5.99X1.65MM

138

NL3026T-02AC

NL3026T-02AC

Marlow Industries, Inc.

MULTISTAGE TEM 8.79X8.79X5.94MM

33

RC6-2.5-01LS

RC6-2.5-01LS

Marlow Industries, Inc.

TEM 23.5X23.5X3.94MM

143

RC12-2.5-01LS

RC12-2.5-01LS

Marlow Industries, Inc.

TEM 30X34X3.93MM

677

RC12-8-01LS

RC12-8-01LS

Marlow Industries, Inc.

TEM 40.13X40.13X3.53MM

985

CM35-1.9-08AN

CM35-1.9-08AN

Marlow Industries, Inc.

TEM 12.19X5.99X1.65MM

45

SP2394-07AB

SP2394-07AB

Marlow Industries, Inc.

MULTISTAGE TEM21.72X28.27X8.69MM

45

RC6-2.5-01

RC6-2.5-01

Marlow Industries, Inc.

TEM 23.5X23.5X3.94MM

60

PL054-6-40-01

PL054-6-40-01

Marlow Industries, Inc.

TEM 40X40X3.91

44

XLT2423-31AC

XLT2423-31AC

Marlow Industries, Inc.

TEM THERMOCYCLER 36.4X50.24X3MM

172

LCC12-8-01LS

LCC12-8-01LS

Marlow Industries, Inc.

TEM THERMOCYCLER 40X40X3.94MM

0

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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