Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
NL1021T-02AC

NL1021T-02AC

Marlow Industries, Inc.

TEM 6.6X6.6X2.16MM

45

RC12-6-01S

RC12-6-01S

Marlow Industries, Inc.

TEM 40.13X40.13X3.97MM

54

NL1022T-05AC

NL1022T-05AC

Marlow Industries, Inc.

TEM 8.79X8.79X2.16MM

29

NL2063T-03AB

NL2063T-03AB

Marlow Industries, Inc.

MULTISTAGE TEM39.64X29.64X5.94MM

2

RC6-4-01S

RC6-4-01S

Marlow Industries, Inc.

TEM 23.5X23.5X3.33MM

55

CM29-1.9-05AC

CM29-1.9-05AC

Marlow Industries, Inc.

TEM 10.2X6.02X1.68MM

42

PL036-4-30-01L

PL036-4-30-01L

Marlow Industries, Inc.

TEM 30X30X3.2MM

25

SP2402-02AB

SP2402-02AB

Marlow Industries, Inc.

MULTISTAGE TEM21.72X28.27X6.73MM

2

NL1020T-04AC

NL1020T-04AC

Marlow Industries, Inc.

TEM 3.96X3.96X2.16MM

22

PL105-7.5-40-01S

PL105-7.5-40-01S

Marlow Industries, Inc.

TEM 40X40X3.1MM

2

CM35-1.9-04AC

CM35-1.9-04AC

Marlow Industries, Inc.

TEM 12.19X5.99X1.65MM

50

RC12-4-01L

RC12-4-01L

Marlow Industries, Inc.

TEM 29.97X29.97X3.33MM

16

NL1020T-05AC

NL1020T-05AC

Marlow Industries, Inc.

TEM 3.96X3.96X2.16MM

38

PL080-8.5-40-01

PL080-8.5-40-01

Marlow Industries, Inc.

TEM 40X40X3.33MM

23

RC3-4-03LS

RC3-4-03LS

Marlow Industries, Inc.

TEM 16X16X3.33MM

70

PL080-8.5-40-01L

PL080-8.5-40-01L

Marlow Industries, Inc.

TEM 40X40X3.33MM

21

PL080-8.5-40-02

PL080-8.5-40-02

Marlow Industries, Inc.

TEM 40X40X3.33MM

19

NL1013T-03AC

NL1013T-03AC

Marlow Industries, Inc.

TEM 1.16X13.16X2.41MM

0

RC6-2.5-01L

RC6-2.5-01L

Marlow Industries, Inc.

TEM 23.5X23.5X3.94MM

53

RC6-2.5-01S

RC6-2.5-01S

Marlow Industries, Inc.

TEM 23.5X23.5X3.94MM

49

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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